Palladium metal sputtering targets are thin film deposition targets made primarily of high-purity palladium through vacuum melting, precision machining, and homogenization pressing. Due to their excellent chemical inertness, superior adhesion properties, and stable thin film structure, palladium targets play an irreplaceable role in microelectronic device manufacturing, functional thin film development, and nanomaterials research.
We offer a variety of sizes, thicknesses, and 99.99% purity Palladium sputtering targets. Shapes (circular, square, rectangular), backplane bonding methods, and grain distributions can be customized to match different vacuum deposition equipment. For inquiries or technical support, please contact us.
High-purity palladium raw material, ensuring stable film quality.
Extremely low inclusion content, suitable for precision semiconductor applications.
Uniform grain size, stable sputtering rate.
Customizable size, shape, and backplane.
Excellent surface flatness, reducing process deviations.
High density, reducing the risk of abnormal target breakage.
Conductive film and diffusion barrier film deposition in the electronics industry.
High-performance sensor and microelectromechanical system (MEMS) manufacturing.
Advanced optical films and functional device coatings.
Preparation and research of catalytic materials and nanostructured materials.
Q1: What packaging method do you use for your palladium targets?
A1: Each target is vacuum-sealed in a dust-free environment, with added cushioning material and a shock-resistant outer box to ensure the surface is not mechanically damaged during transportation.
Q2: What are the advantages of palladium sputtering targets?
A2: Our Pd targets have high density, extremely low oxygen content, and stable film composition, which effectively improves sputtering consistency and is suitable for advanced deposition processes.
Q3: Do you provide processing services, such as backplane bonding? A3: Yes. We support Mo/Cu backplate welding, fine target surface polishing, edge chamfering, and customized thickness processing to ensure a perfect match between the target and the equipment.
Q4: How should palladium targets be stored?
A4: It is recommended to store them in a dry, dust-free environment, keeping them sealed to avoid surface contamination or oxidation. No additional treatment is required before use.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We possess mature precious metal target production capabilities, with strict control over the entire process from raw material purity screening to target sintering, processing, and testing. Through advanced grain control technology, we can manufacture high-density, low-defect palladium sputtering targets suitable for precision thin film deposition.
We support rapid customization, flexible delivery, and engineer technical support, committed to providing a reliable and stable supply of palladium sputtering targets to global semiconductor, coating equipment manufacturers, and research users. Choosing us means securing a sustainable supply, high-quality materials, and highly responsive service.
Chemical Formula: Pd
Atomic Weight: 106.42 g/mol
Appearance: Silvery-white metallic disk or rectangular target
Density: 12.0 g/cm³ (solid)
Melting Point: 1554.9 °C
Boiling Point: 2963 °C
Crystal Structure: Face-Centered Cubic (FCC)
Hardness: Mohs hardness approx. 4.75
Electrical Conductivity: Good electrical conductivity
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
