| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 2900FI001 | Cu | 99.999% | 50 mm x 50 mm x 0.05 mm | Inquire |
| 2900FI002 | Cu | 99.999% | 100 mm x 100 mm x 0.05 mm | Inquire |
| 2900FI003 | Cu | 99.999% | 50 mm x 50 mm x 0.1 mm | Inquire |
| 2900FI004 | Cu | 99.999% | 100 mm x 100 mm x 0.1 mm | Inquire |
| 2900FI005 | Cu | 99.999% | 50 mm x 50 mm x 0.25 mm | Inquire |
| 2900FI006 | Cu | 99.999% | 100 mm x 100 mm x 0.25 mm | Inquire |
Copper Metal Foil is a thin copper material with high conductivity and high ductility, widely used in electronics manufacturing, functional thin films, and precision industries.
We can provide customized copper foils according to thickness, tolerance, and surface condition requirements. Please contact us directly for specification confirmation.
Stable conductivity
Good ductility and flexibility
High thickness uniformity
Controllable surface cleanliness
Suitable for precision machining
Electronics and Circuit Manufacturing: Used for flexible circuits, connection structures, and electronic components, meeting the requirements for conductivity and reliability.
Thin Film and Coating Processes: As a substrate or conductive layer, suitable for various deposition and composite processes.
New Energy and Energy Storage: Used for conductive current collection or structural testing in experimental and small-batch production.
Scientific Research and Experimentation: Easy to cut and shape, suitable for material performance verification and process development.
Q1: What is the typical thickness range of copper foil?
A1: We offer a variety of thickness ranges, which can be customized according to application requirements.
Q2: Is copper foil suitable for bending or rolling?
A2: The material has good ductility, making it suitable for applications requiring flexible structures.
Q3: Does surface condition affect performance?
A3: Surface cleanliness and flatness affect conductivity and adhesion performance, which can be controlled during production.
Q4: Do you support small or special sizes?
A4: Yes, we support cutting or custom processing based on the actual application scenario.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We have extensive experience in copper material processing and quality control, enabling us to consistently provide stable and reliable copper foil products to meet diverse application needs.
Chemical Formula: Cu
Molecular Weight: 63.55 g/mol
Appearance: Metallic brass-colored flakes
Density: 8.96 g/cm³
Melting Point: 1,085 °C
Boiling Point: 2,562 °C
Crystal Structure: Face-Centered Cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
