Tin Silver Alloy Sputtering Target is a high-purity, high-performance alloy target used in sputtering deposition processes for electronic, semiconductor, and photovoltaic applications. The combination of tin (Sn) and silver (Ag) offers unique properties such as high electrical conductivity, corrosion resistance, and excellent thermal stability, making it ideal for various thin-film coating applications.
We offer SnAg alloy sputtering targets in different purity grades and sizes to meet specific deposition requirements. Our technical team is available to assist with material selection, performance evaluation, and application development. Please feel free to contact us for any technical or application-related inquiries.
Purity: 99.9%
Excellent electrical conductivity: Suitable for high-performance electronic and photovoltaic applications
Corrosion resistance: Offers improved corrosion resistance, especially in harsh environments
Thermal stability: Suitable for high-temperature sputtering processes
Customizable sizes: Tailored target sizes and shapes to meet specific sputtering system needs
Semiconductors: Used for deposition of thin films in semiconductor fabrication, including for interconnects and conductive layers
Photovoltaics (Solar Cells): Ideal for depositing back contact layers and conductive coatings on solar cells
Optical coatings: Used in the deposition of high-quality conductive coatings in optical applications
Electronic devices: Suitable for thin-film deposition in electronic components such as capacitors, resistors, and sensors
Catalyst development: Employed in various catalytic applications, including surface coatings for industrial catalysts
Each shipment of SnAg alloy sputtering target is accompanied by:
Certificate of Analysis (COA)
Material Safety Data Sheet (MSDS)
Optional third-party testing reports for enhanced quality assurance
Q1: What purity grades are available for Tin Silver alloy sputtering targets?
A1: We provide 99.9% or higher purity targets, ensuring consistent and reliable deposition performance.
Q2: Can Tin Silver alloy sputtering targets be used in high-temperature sputtering processes?
A2: Yes, SnAg targets exhibit excellent thermal stability, making them ideal for high-temperature sputtering applications.
Q3: What are the key benefits of using Tin Silver alloy sputtering targets in semiconductor applications?
A3: The SnAg alloy offers excellent electrical conductivity, corrosion resistance, and thermal stability, making it ideal for thin-film deposition in semiconductor devices, particularly for conductive layers and interconnects.
Q4: Can you customize the size and shape of SnAg sputtering targets?
A4: Yes, we offer customizable sizes and shapes for SnAg targets to meet the specific requirements of different sputtering systems and applications.
Chemical Formula:SnAg
Purity:99.99%
Appearance:Silver-gray metallic target
Density:7.3 g/cm³
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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