Silicon Rotary Targets are rotating silicon targets used in continuous sputtering processes, suitable for large-area and long-duration deposition requirements. They are primarily used in display panels, photovoltaic thin films, functional coatings, and related vacuum deposition applications.
We can provide silicon rotating targets with different structures and sizes according to equipment requirements, supporting process communication and technical integration. Please contact us directly for solutions.
Rotating structure, high target utilization
Stable and uniform sputtering process
Suitable for long-term continuous operation
Effective for thermal management and heat dissipation
Compatible with various rotating target sputtering systems
Customized structure and size supported
Large-area thin film deposition: Suitable for thin film deposition processes on large-area substrates, helping to improve film uniformity and process stability.
Display and photovoltaic coating processes: In display panel and thin-film photovoltaic manufacturing, the rotating target structure can meet the requirements of continuous production for deposition consistency.
Functional coating preparation: Suitable for preparing electrical, optical, or protective functional thin films, meeting the performance requirements of different application scenarios.
R&D and Process Validation: Widely used for optimizing new process parameters and studying material behavior, supporting stable testing under spinning sputtering conditions.
Q1: What are the characteristics of a silicon rotating target compared to a planar target?
A1: A rotating target participates in sputtering through continuous rotation, which improves target utilization and helps improve film uniformity.
Q2: How effective is the heat dissipation of a silicon rotating target during sputtering?
A2: The rotating structure facilitates heat dissipation, and combined with a reasonable cooling design, it can maintain stable operation of the sputtering process.
Q3: What are the equipment requirements when using a silicon rotating target?
A3: A dedicated cathode structure and cooling system for the rotating target are required, and the specific parameters should be compatible with the equipment model.
Q4: What precautions should be taken when using a silicon rotating target?
A4: It is recommended to operate under stable vacuum and power conditions, and to install and maintain the target according to the equipment specifications.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in application-oriented supply of spinning sputtering targets, emphasizing target structural design and equipment compatibility, and providing customers with stable and reliable product solutions and efficient technical support.
Molecular Formula: Si
Molecular Weight: 28.09 g/mol
Appearance: Silver-gray dense rotating target tube
Density: 2.33 g/cm³
Melting Point: 1414 °C
Boiling Point: 3265 °C
Crystal Structure: Diamond cubic system
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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