ULPMAT

Niobium Silicide

Chemical Name:
Niobium Silicide
Formula:
NbSi2
Product No.:
411400
CAS No.:
12034-80-9
EINECS No.:
234-812-3
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
411400ST001 NbSi2 99.5% Ø 50.8 mm x 3.175 mm Inquire
411400ST002 NbSi2 99.5% Ø 76.2 mm x 6.35 mm Inquire
Product ID
411400ST001
Formula
NbSi2
Purity
99.5%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
411400ST002
Formula
NbSi2
Purity
99.5%
Dimension
Ø 76.2 mm x 6.35 mm

Niobium Silicide Sputtering Target Overview

Niobium Silicide sputtering targets are high-melting-point intermetallic compound targets with excellent high-temperature resistance, oxidation resistance, and mechanical stability, making them suitable for high-temperature functional film and composite film deposition. They are primarily used for the preparation of high-temperature functional films, oxidation-resistant coatings, composite electronic films, and thermal protection films.

We offer various specifications of NbSi₂ targets, including circular, rectangular, and rotating targets, with a purity of up to 99.5%. Targets are prepared using hot pressing, vacuum sintering, or high-temperature diffusion bonding processes, resulting in high density, uniform film formation, and long lifespan. Custom sizes, thicknesses, and backplane structures are available to meet the needs of research and industrial applications. Contact us.

Product Highlights

High-melting-point intermetallic compound sputtering targets
Excellent high-temperature resistance and oxidation resistance
High density, uniform film formation
Customizable size, thickness, and backplane structure
Batch stability, reliable sputtering performance
Long-life targets, suitable for industrial mass production
Supports target bonding
Supports rotating targets and customized thermal management designs

Applications of Niobium Silicide Sputtering Targets

High-temperature functional film preparation: Used for high-temperature thin film deposition in aerospace and industrial applications.
Oxidation-resistant coatings: Enhance the oxidation and corrosion resistance of metal or ceramic surfaces.
Electron composite films: Used for conductive films, barrier layers, or functional electronic film deposition.
Thermal protection films and protective coatings: Used for thermal barrier coatings, gas turbine and high-temperature component surface protection.

FAQs

Q1: How are NbSi2 sputtering targets packaged?
A1: Targets are sealed or vacuum-packed with shockproof outer boxes to ensure no damage or oxidation during transportation.

Q2: What processing and customization processes are supported for the targets?
A2: We offer hot pressing sintering, CNC precision machining, surface grinding and polishing, backplate diffusion bonding, and custom rotating target services.

Q3: How should NbSi2 sputtering targets be stored?
A3: It is recommended to store them in a dry, ventilated, and light-protected environment, avoiding moisture and oxidizing gases to maintain target performance stability.

Q4: What purity level can NbSi2 sputtering targets achieve?
A4: We can provide 99.5% high-purity targets, along with a complete composition analysis report and a Certificate of Account (COA).

Reports

Each batch is provided with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports are available upon request.

Why Choose Us?

Supplier of high-purity, high-density intermetallic compound sputtering targets
Extensive experience in high-temperature and oxidation-resistant applications
Customization of size, thickness, and backplate structure available
Stable batch production, suitable for research and industrial manufacturing
Complete testing system ensures traceability of target performance
Technical team provides sputtering process guidance and application advice
Extensive global shipping experience, ensuring safe and reliable packaging

Chemical Formula: NbSi₂
Molecular Weight: 149.08 g/mol
Appearance: Gray, dense target material, cylindrical or disc-shaped
Density: ≈ 6.35 g/cm³
Melting Point: Approximately 2030 ℃
Crystal Structure: Tetragonal (C40 type structure)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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