Magnesium silicate sputtering targets are high-density, high-purity ceramic targets with excellent thermal stability and chemical inertness. They are suitable for magnetron or RF sputtering processes for optical thin films, electronic ceramic films, and functional coatings.
We offer magnesium silicate targets in various sizes, thicknesses, and densities, and can customize copper or aluminum backplane bonding solutions according to customer equipment requirements. Please contact us for parameters and quotations.
High density, excellent sputtering stability
Excellent thermal stability, no deformation after long-term deposition
Smooth surface, high film uniformity
Strong chemical inertness, adaptable to various processes
Can be bonded with copper/aluminum backplanes to improve heat dissipation efficiency
Supports various sizes, thicknesses, and customized specifications
Optical Thin Film Preparation: Magnesium silicate targets can deposit dense, transparent films in RF or magnetron sputtering, ensuring film uniformity and repeatability.
Electronic Ceramic Films: Used for coating high-performance electronic devices, improving the dielectric properties and stability of thin films.
Functional Coating Deposition: Suitable for wear-resistant, heat-resistant, or high-stability coatings, meeting specific process requirements.
Research and Process Validation: Suitable for sputtering process validation in laboratories and pilot-scale operations, facilitating parameter optimization and material evaluation.
Q1: Which equipment is MgSiO₃ sputtering target suitable for?
A1: It can be used in research and industrial thin film deposition equipment such as radio frequency (RF) sputtering and magnetron sputtering.
Q2: Does target density affect film uniformity?
A2: High-density targets reduce the risk of particle detachment, improving film uniformity and repeatability.
Q3: Can target size and backplate bonding be customized?
A3: Yes, we can provide round, square, and special-sized targets, and offer copper or aluminum backplate bonding solutions to improve heat dissipation efficiency and lifespan.
Q4: What are the precautions for backplate bonding?
A4: The contact surface between the target and the backplate must be flat. After bonding, avoid moisture or contamination to ensure good heat conduction and target stability during sputtering.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in the preparation of high-purity MgSiO₃ sputtering targets and backplane bonding technology, providing products with high density, dimensional control, and high film uniformity. We also offer technical support tailored to customer equipment and process requirements, helping customers efficiently complete thin film deposition and process validation.
Formula: MgSiO3
Molecular Weight: 100.39 g/mol
Appearance: White, dense target
Density: 3.2–3.25 g/cm³ (sintered target)
Melting Point: 1540 °C
Crystal Structure: Monoclinic (pyroxene structure)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
