Gold Tin Alloy

Gold Tin Alloy Sputtering Target Overview

Gold Tin Alloy sputtering targets are high-performance materials designed for thin film deposition processes and are widely used in the semiconductor, optoelectronics, electronics and microelectronics industries. Their excellent purity and physical properties ensure uniform thin film deposition, good adhesion and very low impurity content.

We offer Gold Tin Alloy sputtering targets in a variety of shapes and sizes, including round, rectangular and other custom shapes, and can provide customized solutions based on your specific requirements. We also provide comprehensive after-sales support – if you have any questions about use, please feel free to contact us.

Product Highlights

Purity: 99.99%
High density, ensuring uniform thin film deposition
See the target bonding service
Customizable size and shape
Suitable for semiconductors, electronic packaging, sensors and optical coatings

Applications of Gold Tin Alloy Sputtering Target

Semiconductors: Used in the manufacture of microelectronic components, especially for packaging and interconnection.
Electronic packaging: Widely used in welding materials for electronic components, providing high reliability and long-term stability.
Sensors: Used for thin film deposition of sensor components, with good conductivity and chemical stability.
Optical Coatings: Coatings for lenses, mirrors and optical components provide high stability and durability.

Reports

We provide Certificate of Analysis (COA), Material Safety Data Sheet (MSDS) and other relevant reports for each batch of Gold Tin Alloy sputtering targets. In addition, we also support third-party testing to enhance quality assurance and ensure that products meet industry standards.