ULPMAT

ULPMAT is a professional manufacturer of coating materials, dedicated to supplying the highest quality sputtering targets and evaporation materials.

We offer a full range of sputtering targets including metals, alloys, ceramics and custom composite targets. Whether you need flat or rotary targets, we have the expertise to meet a wide range of applications.

Product categories

What Are Sputtering Targets?

 

Sputtering targets are key materials in the Physical Vapor Deposition (PVD) process. They serve as the source atoms that are bombarded and transferred onto substrates to form thin films. Applications include semiconductors, displays, solar panels, and precision coatings.

Think of it as a microscopic “metal transfer”—where high-energy ions knock atoms off a solid target and deposit them onto a substrate surface.

Classification by Material

  • Metal Targets: Al, Ti, W, Si, etc.
  • Alloy Targets: Ti-Al, W-Mo, Cu-Zn
  • Ceramic Targets: Al₂O₃, ZnO, ITO
  • Composite Targets: Nitrides, carbides, sulfides

 

Sputtering Targets

 

Classification by Shape

  • Planar Targets: Circular, rectangular, custom shapes
  • Rotary Targets: Cylindrical rotating targets for higher material utilization

How Sputtering Works

1. Gas Ionization: Argon is ionized in a vacuum.

2. Ion Bombardment: High-energy ions hit the target surface, ejecting atoms.

3. Thin Film Deposition: Ejected atoms condense on the substrate to form a film.

Sputtering Process Diagram

Performance Requirements

  • Purity: ≥99.9% to ensure film quality
  • Density: High density reduces particle contamination
  • Uniform Composition: Ensures stable film characteristics
  • Crystal Structure: Affects sputtering efficiency
  • Dimensional Accuracy: For reliable installation and operation
  • Thermal & Chemical Stability: To withstand harsh conditions

Fabrication Processes

  1. Melting and Casting: For metals like Al, Cu, Cr – cost-effective, but not ideal for reactive or high-melting-point materials.

Casting Target Application

  1. Powder Metallurgy (PM): For ceramics and complex alloys – high purity and density, widely used for ITO, ZnO, TiO₂ targets.
  2. Hot Isostatic Pressing (HIP): For dense, high-performance targets – ideal for oxides, borides, and ceramics.
  3. Spark Plasma Sintering (SPS): Fast sintering for lab or specialty targets – minimal grain growth, high retention.

HIP SPS Targets

  1. Cold Pressing + Hot Sintering: Simplified method for standard target production – lower cost, good for small-medium batches.
Sputtering Target Types

Key Properties

  • High purity
  • High density and uniform structure
  • Good thermal and electrical conductivity
  • Corrosion and thermal shock resistance

Applications

Semiconductors: Metal and dielectric films for ICs and packaging

Displays: LCD, OLED layers including TCOs and emitters

Solar Cells: Si and CIGS films to enhance efficiency

Optics: AR coatings, filters, mirrors

Aerospace: Wear-resistant, protective coatings

Contact us today to explore our full range of high-performance sputtering targets — and let’s work together to achieve exceptional thin film results.

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