ULPMAT

Vanadium metal

Chemical Name:
Vanadium metal
Formula:
V
Product No.:
2300
CAS No.:
7440-62-2
EINECS No.:
231-171-1
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
2300ST001 V 99.9% Ø 25.4mm x 6.35mm Inquire
2300ST002 V 99.9% Ø 50.8mm x 3.175mm Inquire
2300ST003 V 99.9% Ø 50.8mm x 6.35mm Inquire
2300ST004 V 99.95% Ø 76.2mm x 3.175mm Inquire
2300ST005 V 99.95% Ø 76.2mm x 6.35mm Inquire
2300ST006 V 99.95% Ø 100mm x 10mm Inquire
2300ST007 V 99.95% Ø 101.6mm x 6.35mm Inquire
2300ST008 V 99.95% 200 mm x 100 mm x 10 mm Inquire
2300ST009 V 99.9% 639 mm x 145 mm x 6 mm Inquire
Product ID
2300ST001
Formula
V
Purity
99.9%
Dimension
Ø 25.4mm x 6.35mm
Product ID
2300ST002
Formula
V
Purity
99.9%
Dimension
Ø 50.8mm x 3.175mm
Product ID
2300ST003
Formula
V
Purity
99.9%
Dimension
Ø 50.8mm x 6.35mm
Product ID
2300ST004
Formula
V
Purity
99.95%
Dimension
Ø 76.2mm x 3.175mm
Product ID
2300ST005
Formula
V
Purity
99.95%
Dimension
Ø 76.2mm x 6.35mm
Product ID
2300ST006
Formula
V
Purity
99.95%
Dimension
Ø 100mm x 10mm
Product ID
2300ST007
Formula
V
Purity
99.95%
Dimension
Ø 101.6mm x 6.35mm
Product ID
2300ST008
Formula
V
Purity
99.95%
Dimension
200 mm x 100 mm x 10 mm
Product ID
2300ST009
Formula
V
Purity
99.9%
Dimension
639 mm x 145 mm x 6 mm

Vanadium metal sputtering targets overview

Vanadium metal sputtering targets are functional metal materials used for thin film deposition, exhibiting excellent stability and controllable sputtering performance. These products are widely used in semiconductor thin films, functional coatings, scientific research experiments, and related vacuum deposition fields.

We offer vanadium metal sputtering targets in various sizes and structures, supporting custom processing. Please contact us for technical solutions.

Product Highlights

Uniform metal composition
Stable sputtering process
High target density
Compatible with various vacuum equipment
Capable of backplane bonding
Custom sizes supported

Applications of Vanadium metal sputtering targets

Semiconductor and microelectronic thin films: Vanadium metal sputtering targets can be used to deposit vanadium metal thin films, suitable for the fabrication of microelectronic devices and related structural layers.

Functional coatings and surface modification: In the field of functional coatings, this target is often used to prepare metal thin films with wear resistance, conductivity, or special physical properties.

Scientific research and laboratory sputtering studies: Vanadium targets are widely used in universities and research institutions for process exploration and performance testing of novel thin film materials.

Specialty Materials and Process Development: Vanadium metal sputtering targets serve as an important source of metal deposition in the development of new materials and processes.

FAQs

Q1: Which sputtering method is suitable for vanadium metal sputtering targets?
A1: These targets can be used for DC sputtering or RF sputtering; the specific method depends on the equipment configuration and process requirements.

Q2: Are vanadium targets stable during sputtering?
A2: Under appropriate process parameters, vanadium metal targets exhibit good sputtering stability, which helps obtain uniform thin films.

Q3: Can vanadium metal sputtering targets be backplane bonded?
A3: Yes, depending on the application requirements, vanadium targets can be bonded to materials such as copper backplanes to improve heat dissipation and installation stability.

Q4: Is a vanadium target suitable for research or mass production?
A4: This product is suitable for both process verification in scientific research experiments and small-batch or customized production scenarios.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We have long focused on supplying sputtering targets and related metal materials. We are familiar with the application characteristics of vanadium metal in thin film deposition and can provide stable target quality, flexible customization capabilities, and clear technical support to help customers smoothly advance their sputtering projects.

Molecular Formula: V
Molecular Weight: 50.9415 g/mol
Appearance: Silver-gray metallic target
Density: 6.11 g/cm³
Melting Point: 1910°C
Boiling Point: 3377°C
Crystal Structure: Hexagonal close-packed (hcp)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

Documents

No PDF files found.

Contact Us

If you need any service, please contact us

More Information

more products

CONTACT US

Thermal Spray

Our website has been completely upgraded