ULPMAT

Tungsten Silicide

Chemical Name:
Tungsten Silicide
Formula:
WSi2
Product No.:
741400
CAS No.:
12039-88-2
EINECS No.:
234-909-0
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
741400ST001 WSi2 99.5% Ø 50.8 mm x 3.175 mm Inquire
741400ST002 WSi2 99.5% Ø 76.2 mm x 3.175 mm Inquire
741400ST003 WSi2 99.5% Ø 76.2 mm x 6.35 mm Inquire
741400ST004 WSi2 99.5% Ø 101.6 mm x 3.175 mm Inquire
741400ST005 WSi2 99.5% Ø 101.6 mm x 6.35 mm Inquire
Product ID
741400ST001
Formula
WSi2
Purity
99.5%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
741400ST002
Formula
WSi2
Purity
99.5%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
741400ST003
Formula
WSi2
Purity
99.5%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
741400ST004
Formula
WSi2
Purity
99.5%
Dimension
Ø 101.6 mm x 3.175 mm
Product ID
741400ST005
Formula
WSi2
Purity
99.5%
Dimension
Ø 101.6 mm x 6.35 mm

Tungsten Silicide sputtering target Overview

Tungsten Silicide sputtering target is a composite target material designed for high-performance thin film deposition applications. It combines the high melting point of tungsten with the chemical stability of silicon, has excellent thermal stability, resistivity control ability and good film uniformity, and is very suitable for microelectronic devices, resistive films and hard protective films.

We can provide Tungsten Silicide sputtering targets of different sizes and shapes, including round, rectangular and various composite structures, and support customized services to meet various PVD process requirements. If you have any questions during use, please feel free to contact us, we will provide comprehensive technical support and after-sales service.

Product highlights

Purity: 99.5%
Dense structure ensures stable sputtering process and uniform film
High hardness and strong corrosion resistance, suitable for harsh environments
Customized size, shape, hole position or backplane design according to customer needs
Good resistivity control, suitable for thin film resistors and barrier layers

Applications of Tungsten Silicide sputtering target

Microelectronic devices: As a barrier layer or interlayer material to prevent metal diffusion and improve device reliability
Thin film resistors: Used for precision resistor films with stable resistivity and good temperature coefficient
Hard coating: Provides wear and corrosion protection for surfaces such as tools and molds
MEMS/sensors: Used as functional films to improve device performance and life

Reports

We provide Material Safety Data Sheet (MSDS), Certificate of Analysis (COA) and related test reports for each batch of WSi₂ sputtering targets, and support customer-specified third-party testing requirements to ensure that products meet quality and safety standards.

Molecular formula: WSi₂
Molecular weight: 240.01 g/mol
Appearance: Gray-black metallic luster ceramic target, dense and flat surface
Density: about 9.3 g/cm³ (close to theoretical density)
Melting point: about 2,160 °C
Crystal structure: tetragonal system

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

SKU 741400ST Category Brand:

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