Tungsten Selenide sputtering targets are functional composite materials designed for thin film deposition processes and are widely used in semiconductor devices, optoelectronic devices, and two-dimensional material research. The material combines the high melting point of tungsten with the excellent optoelectronic properties of selenium to form two-dimensional thin film structures with unique bandgap properties.
We offer Tungsten Selenide sputtering targets in various shapes and sizes, and can be customized according to your specific requirements. Our products have stable composition, dense structure and excellent target uniformity, ensuring your thin film deposition process is smooth and reliable.
Purity: 99.9%
Uniform composition, high film consistency
Customizable size and shape (diameter, thickness, etc.)
Suitable for CVD, PVD, magnetron sputtering and other processes
High-quality crystalline thin film deposition, suitable for two-dimensional material preparation
Target Bonding
Semiconductor devices: Channel materials used in next-generation transistors and FET devices, with adjustable bandgap and high mobility characteristics.
Optoelectronic devices: Can be used in devices such as photodetectors and solar cells, showing good light absorption performance.
Sensors and energy storage devices: They show good electrochemical response characteristics in gas sensors, supercapacitors, etc.
Research and development: They are widely used in the field of structure and performance research of two-dimensional materials (2D Materials).
We provide a complete certificate of analysis (COA), material safety data sheet (MSDS) and other technical parameter reports for each batch of products. We can provide third-party testing data according to customer requirements to enhance product reliability and use assurance.
Molecular formula: WSe₂
Molecular weight: 341.76 g/mol
Appearance: Gray-black ceramic target with dense and smooth surface
Density: about 6.5 g/cm³ (close to theoretical density)
Melting point: about 1,250 °C
Crystal structure: hexagonal (layered structure)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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