Titanium Nitride sputtering targets are important titanium-based ceramic targets with high hardness, high melting point, and chemical stability. They are widely used in physical vapor deposition (PVD) processes to prepare wear-resistant and corrosion-resistant functional thin films, suitable for hard coatings, tool coatings, and surface treatment of electronic devices.
We offer high-purity, dense, and uniform TiN sputtering targets suitable for DC or RF magnetron sputtering systems. Different sizes, shapes, and bonding methods can be customized to meet the needs of research and industrial production.
High hardness and wear resistance, stable film performance
Good chemical inertness, suitable for various substrates
Dense target, reducing sputtering inhomogeneity
Supports continuous sputtering and industrial applications
High purity and compositional uniformity ensure film quality
Functional Hard Coatings: Can be used for surface coating of cutting tools, molds, and high-wear-resistant parts.
Electronic Devices and Semiconductor Thin Films: Used for surface coating of microelectronic devices and the preparation of conductive thin films. Scientific Research and New Material Development: Widely used in universities, research institutions, and laboratories for research on functional thin films and PVD processes.
Q1: How to choose the appropriate TiN sputtering target size and shape?
A1: Select the target size and shape based on the sputtering equipment specifications, substrate size, and deposition requirements. Custom options are available upon request from sales.
Q2: What precautions should be taken when storing and transporting TiN sputtering targets?
A2: Keep them dry, avoid moisture and mechanical damage, and prevent surface contamination and breakage.
Q3: Can sputtering target formulations or alloying treatments be performed?
A3: Formulations can be adjusted or alloyed with other elements according to customer needs to meet specific thin film performance requirements.
Q4: Which sputtering processes are TiN sputtering targets suitable for?
A4: Suitable for DC magnetron sputtering, RF magnetron sputtering, and multilayer composite thin film deposition processes.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in titanium-based ceramics and sputtering targets, providing high-purity, dense, and uniform TiN sputtering targets, along with complete customization and storage solutions, ensuring stability and reliability for research and industrial applications.
Molecular Formula: TiN
Appearance: Golden yellow or black target material
Density: Approximately 5.43 g/cm³
Melting Point: Approximately 2960 °C
Crystal Structure: Cubic (NaCl type structure)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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