Titanium nickel alloy sputtering targets combine the high strength of titanium with the corrosion resistance and ductility of nickel. These targets are widely used in physical vapor deposition (PVD) processes to prepare functional metal thin films, corrosion-resistant coatings, and surface modification materials for microelectronic devices.
We offer high-purity, dense, and uniformly composed Ti-Ni sputtering targets suitable for DC or RF magnetron sputtering systems. Custom sizes, shapes, and bonding methods can be provided to meet both research and industrial production needs.
Alloy design enhances film corrosion resistance and mechanical properties.
Dense and uniform target ensures stable film deposition.
Excellent film adhesion and interfacial properties.
Applicable to various substrates and PVD process conditions.
Supports continuous sputtering and industrial applications.
Corrosion-resistant functional thin films: Used for corrosion-resistant, wear-resistant functional thin films and surface coatings.
Electronic device and microstructure thin films: Suitable for high-precision thin film deposition of microelectronic devices and functional surface coatings.
Research and Process Development: Widely used in universities, research institutions, and laboratories for research on functional metal thin films and PVD processes.
Q1: Which thin film deposition processes is the Titanium Nickel Alloy Sputtering Target suitable for?
A1: It can be used for DC magnetron sputtering, RF magnetron sputtering, and multilayer composite thin film deposition processes.
Q2: What is the role of nickel in the alloy?
A2: Nickel improves the corrosion resistance and ductility of the thin film, making it more suitable for functional coatings and industrial applications.
Q3: How to choose the appropriate Titanium Nickel Alloy Sputtering Target size and shape?
A3: The target size and shape are selected according to the sputtering equipment model, substrate size, and deposition requirements. Customization services are available.
Q4: What are the precautions for storing and transporting TiNi sputtering targets?
A4: Keep dry, avoid moisture and mechanical damage, and prevent surface contamination and breakage.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in titanium-based and alloy sputtering targets, providing high-purity, uniformly composed TiNi sputtering targets and customized solutions to ensure thin film quality and process stability for research and industrial applications.
Molecular Formula: TiNi
Appearance: Silver-gray target material
Density: Approx. 6.45 g/cm³
Melting Point: Approx. 1315 °C
Crystal Structure: Cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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