ULPMAT

Titanium metal

Chemical Name:
Titanium metal
Formula:
Ti
Product No.:
2200
CAS No.:
7440-32-6
EINECS No.:
231-142-3
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
2200ST001 Ti 99.9% Ø 25.4mm x 6.35mm Inquire
2200ST002 Ti 99.9% Ø 50.8mm x 6.35mm Inquire
2200ST003 Ti 99.95% Ø 25.4mm x 3.175mm Inquire
2200ST004 Ti 99.99% Ø 50.8mm x 3.175mm Inquire
2200ST005 Ti 99.99% Ø 76.2mm x 3.175mm Inquire
2200ST006 Ti 99.995% Ø 25.4mm x 3.175mm Inquire
2200ST007 Ti 99.995% Ø 76.2mm x 6.35mm Inquire
2200ST008 Ti 99.999% Ø 76.2mm x 3.175mm Inquire
2200ST009 Ti 99.999% Ø 76.2mm x 6.35mm Inquire
2200ST010 Ti 99.999% Ø 101.6mm x 6.35mm Inquire
2200ST011 Ti 99.999% Ø 203.2mm x 6.35mm Inquire
Product ID
2200ST001
Formula
Ti
Purity
99.9%
Dimension
Ø 25.4mm x 6.35mm
Product ID
2200ST002
Formula
Ti
Purity
99.9%
Dimension
Ø 50.8mm x 6.35mm
Product ID
2200ST003
Formula
Ti
Purity
99.95%
Dimension
Ø 25.4mm x 3.175mm
Product ID
2200ST004
Formula
Ti
Purity
99.99%
Dimension
Ø 50.8mm x 3.175mm
Product ID
2200ST005
Formula
Ti
Purity
99.99%
Dimension
Ø 76.2mm x 3.175mm
Product ID
2200ST006
Formula
Ti
Purity
99.995%
Dimension
Ø 25.4mm x 3.175mm
Product ID
2200ST007
Formula
Ti
Purity
99.995%
Dimension
Ø 76.2mm x 6.35mm
Product ID
2200ST008
Formula
Ti
Purity
99.999%
Dimension
Ø 76.2mm x 3.175mm
Product ID
2200ST009
Formula
Ti
Purity
99.999%
Dimension
Ø 76.2mm x 6.35mm
Product ID
2200ST010
Formula
Ti
Purity
99.999%
Dimension
Ø 101.6mm x 6.35mm
Product ID
2200ST011
Formula
Ti
Purity
99.999%
Dimension
Ø 203.2mm x 6.35mm

Titanium Metal Sputtering Target Overview

Titanium metal sputtering target is a high-purity metallic target widely used for physical vapor deposition (PVD) processes to form titanium or titanium-based functional thin films. It is commonly applied in semiconductor devices, optical coatings, corrosion-resistant layers, and advanced surface engineering.

We supply titanium sputtering targets with stable composition and controlled microstructure, supporting reliable thin film deposition for industrial and research applications,contact our technical team for tailored solutions.

Product Highlights

High-purity titanium material
Uniform grain structure
Excellent sputtering stability
Low particle generation
High target density
Consistent film composition
Suitable for DC and RF sputtering
Compatible with bonded and monoblock designs

Applications of Titanium Metal Sputtering Target

Semiconductor Thin Films:Titanium sputtering targets are widely used to deposit Ti or Ti-based layers as adhesion layers, diffusion barriers, and conductive films in semiconductor manufacturing.
Optical Coatings:Titanium thin films prepared by sputtering are used in optical interference coatings, reflective layers, and functional multilayer systems requiring precise thickness control.
Corrosion-Resistant Coatings:Titanium coatings provide excellent chemical stability and corrosion resistance, making them suitable for protective layers in harsh chemical or marine environments.
Decorative and Functional Coatings:Titanium sputtered films are applied in decorative coatings, wear-resistant layers, and surface modification for tools and mechanical components.

FAQs

Q1: What sputtering methods are suitable for titanium metal targets?
A1:Titanium sputtering targets are compatible with DC magnetron sputtering and RF sputtering systems, depending on equipment configuration and process requirements.

Q2: How does titanium target density affect thin film quality?
A2:Higher target density contributes to more stable sputtering rates, reduced arcing, and improved film uniformity during long deposition runs.

Q3: Can titanium sputtering targets be supplied in bonded form?
A3:Yes, titanium targets can be supplied as bonded targets to backing plates to enhance thermal conductivity and mechanical stability during sputtering.

Q4: What industries commonly use titanium sputtering targets?
A4:They are widely used in semiconductor manufacturing, optics, surface engineering, energy devices, and materials research.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

With experience in metallic sputtering materials, we focus on controlled raw materials, stable processing, and consistent quality management to ensure reliable titanium sputtering targets for both industrial production and R&D applications.

Molecular Formula: Ti
Molecular Weight: 47.87 g/mol
Appearance: Silver-gray dense target
Density: 4.51 g/cm³
Melting Point: 1668 °C
Boiling Point: 3287 °C
Crystal Structure: Hexagonal close-packed (α-Ti, hcp)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

Documents

No PDF files found.

Contact Us

If you need any service, please contact us

More Information

more products

CONTACT US

Thermal Spray

Our website has been completely upgraded