Titanium Copper Zinc Sputtering Target is composed of titanium, copper, and zinc. Through a multi-element alloy design, it achieves a good balance between film adhesion, conductivity, and environmental stability. This target is suitable for various physical vapor deposition (PVD) processes and is commonly used in the preparation of functional metal thin films, decorative coatings, and engineering application films.
We can provide TiCuZn alloy sputtering targets with uniform composition and dense microstructure, suitable for DC or RF magnetron sputtering systems. We support customization of different sizes, shapes, and bonding methods to meet the needs of scientific research and industrial production.
Multi-element alloy system, which helps to control the overall performance of the thin film
Good film adhesion and interface stability
Balancing conductivity and structural reliability
Suitable for continuous sputtering and large-scale applications
Stable alloy composition, which is beneficial for controlling film consistency
Functional metal and transition layer thin films: Commonly used as transition layers in functional thin films or multilayer structures to improve the overall adhesion and stability of the thin film system.
Decorative and Engineering Coatings: In decorative coatings and engineering surface treatments, this alloy film can be used to obtain uniform and stable metallic appearance and properties.
Electronics and Device-Related Thin Films: Suitable for metal thin film deposition needs in electronic devices and related engineering applications.
Research and Process Development: Widely used in universities and research institutions for research on multi-element alloy thin film systems and sputtering process parameters.
Q1: What types of thin films are TiCuZn alloy sputtering targets typically used for?
A1: This target is mainly used for metal thin films, functional thin films, and transition layers in multilayer structures.
Q2: Is the TiCuZn alloy target suitable for continuous or industrial sputtering processes?
A2: Under reasonable process parameters and stable target quality conditions, this alloy target can support continuous sputtering and large-scale applications.
Q3: What are the respective roles of copper and zinc in thin film performance?
A3: Copper mainly contributes to electrical conductivity, while zinc helps to regulate the thin film structure and environmental stability.
Q4: What substrates are suitable for TiCuZn alloy sputtering targets?
A4: Typically applicable for thin film deposition on silicon, glass, metals, and various engineering substrates.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in multi-element alloy sputtering targets and advanced thin film materials, emphasizing target density, compositional consistency, and process adaptability. We provide stable and reliable material solutions for TiCuZn alloy thin film deposition.
Molecular formula: TiCuZn
Appearance: Silver-gray to metallic luster target material
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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