Titanium Chromium Sputtering Target is composed of titanium and chromium, combining the excellent adhesion of titanium-based materials with the corrosion resistance of chromium-based materials. It is suitable for various physical vapor deposition (PVD) processes. This target is commonly used to prepare metallic or functional thin films with excellent adhesion, stable structure, and environmental resistance.
We can provide uniformly composed and densely structured TiCr alloy sputtering targets suitable for DC or RF magnetron sputtering systems. We support customized requirements for different sizes, shapes, and bonding methods to meet research and industrial production applications.
Excellent film adhesion and interfacial stability
Balancing corrosion resistance and mechanical stability
Suitable for various substrates and sputtering process conditions
Stable alloy system, conducive to film uniformity
Suitable for continuous sputtering and large-scale applications
Functional and Transition Layer Thin Films: TiCr alloy thin films are commonly used as transition layers in functional thin films or multilayer structures to improve the overall adhesion and stability of the thin film system.
Corrosion Resistance and Protective Coatings: Used in electronic devices and engineering applications to improve the corrosion resistance of materials in complex environments.
Microelectronics and Device Manufacturing: Suitable for metal thin film deposition in the manufacturing of microelectronics, sensors, and related devices.
Research and Process Development: Widely used in universities and research institutions for alloy thin film composition control and sputtering process optimization.
Q1: What types of thin film structures is the Titanium Chromium Sputtering Target typically used for?
A1: Primarily used for metal thin films, functional thin films, and transition or adhesion layers in multilayer structures.
Q2: What are the advantages of TiCr targets in terms of thin film adhesion?
A2: Titanium helps improve the adhesion between the thin film and the substrate, while chromium enhances the structural stability of the thin film.
Q3: What substrates are suitable for TiCr alloy sputtering targets?
A3: This target can be used for thin film deposition on silicon, glass, metals, and various engineering substrates.
Q4: Is the TiCr alloy sputtering target suitable for long-term or continuous sputtering processes?
A4: Under reasonable process parameter control, the target material can support a stable continuous sputtering process.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in alloy sputtering targets and advanced thin film materials, emphasizing target density, compositional consistency, and process compatibility, providing stable and reliable material solutions for TiCr alloy thin film deposition.
Molecular Formula: TiCr
Appearance: Silver-gray target material
Density: Approx. 4.5 g/cm³
Melting Point: Approx. 1725 °C
Crystal Structure: Body-centered cubic (BCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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