ULPMAT

Titanium Boride

Chemical Name:
Titanium Boride
Formula:
TiB2
Product No.:
220500
CAS No.:
12045-63-5
EINECS No.:
234-961-4
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
220500ST001 TiB2 99.5% Ø 50.8mm x 3.175mm Inquire
220500ST002 TiB2 99.5% Ø 50.8mm x 6.35mm Inquire
220500ST003 TiB2 99.5% Ø 101.6mm x 6.35mm Inquire
220500ST004 TiB2 99.5% Ø 202.3mm x 3.175mm Inquire
220500ST005 TiB2 99.5% Ø 202.3mm x 6.35mm Inquire
220500ST006 TiB2 99.5% 690*145*10mm Inquire
220500ST007 TiB2 99.5% 172.5*145*10mm Inquire
Product ID
220500ST001
Formula
TiB2
Purity
99.5%
Dimension
Ø 50.8mm x 3.175mm
Product ID
220500ST002
Formula
TiB2
Purity
99.5%
Dimension
Ø 50.8mm x 6.35mm
Product ID
220500ST003
Formula
TiB2
Purity
99.5%
Dimension
Ø 101.6mm x 6.35mm
Product ID
220500ST004
Formula
TiB2
Purity
99.5%
Dimension
Ø 202.3mm x 3.175mm
Product ID
220500ST005
Formula
TiB2
Purity
99.5%
Dimension
Ø 202.3mm x 6.35mm
Product ID
220500ST006
Formula
TiB2
Purity
99.5%
Dimension
690*145*10mm
Product ID
220500ST007
Formula
TiB2
Purity
99.5%
Dimension
172.5*145*10mm

Titanium boride Sputtering Target Overview

Titanium boride Sputtering Target is a high-hardness, high-melting-point ceramic sputtering target with excellent electrical conductivity and chemical stability. It is widely used in the development of high-hardness coatings, conductive ceramic films, functional thin films, and scientific thin film materials.

We offer TiB₂ sputtering targets with uniform composition and dense structure, suitable for DC or RF magnetron sputtering systems. Please contact us for detailed specifications and technical information.

Product Highlights

High-hardness, high-melting-point ceramic target
Good electrical conductivity, stable thin film deposition
High temperature and corrosion resistance, strong thermal stability
Suitable for high-temperature, vacuum, and inert atmosphere deposition
High batch consistency
Customizable sizes and shapes
Suitable for scientific and industrial thin film preparation

Applications of Titanium Diboride Sputtering Target

High-hardness, wear-resistant coatings: Can be used to prepare wear-resistant, high-hardness coatings, widely used on the surfaces of cutting tools, molds, and industrial equipment.
Conductive Ceramic Films and Composite Films: Utilizing its conductivity and chemical stability, TiB2 can be used to prepare metal-ceramic composite films and conductive ceramic films for electronic devices and functional materials.
Research and Thin Film Development: Applicable to TiB2 functional thin film research, development of novel high-hardness coatings, and film performance testing.
High-Temperature Corrosion-Resistant Coatings: TiB2 films exhibit stability in high-temperature and corrosive environments, making them suitable for protective coatings and high-temperature electronic devices.

FAQs

Q1: Which sputtering method is suitable for TiB2 targets?
A1: Suitable for DC magnetron sputtering and RF magnetron sputtering. It has good conductivity and is adaptable to various PVD processes.

Q2: Is the composition of TiB2 targets stable during sputtering?
A2: Under appropriate process conditions, the target maintains stable chemical composition, resulting in good film repeatability and consistency.

Q3: Are TiB2 targets suitable for high-temperature deposition?
A3: Yes, this target has excellent thermal stability and thermal shock resistance, making it suitable for high-temperature thin film deposition.

Q4: What are the main applications of TiB2 sputtering targets?
A4: Mainly used in the development of wear-resistant coatings, conductive ceramic films, functional films, and scientific research thin film materials.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We focus on the research and supply of high-performance ceramic sputtering targets, ensuring that TiB2 sputtering targets meet scientific and industrial standards in terms of material structure, densification, and sputtering compatibility, providing reliable assurance for the preparation of functional thin films and high-hardness coatings.

Molecular Formula: TiB₂
Molecular Weight: 69.72 g/mol
Appearance: Black target material
Density: 4.5 g/cm³
Melting Point: Approx. 3225 °C
Crystal Structure: Hexagonal (P6₃/mmc)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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