ULPMAT

Tin Silver Copper Alloy

Chemical Name:
Tin Silver Copper Alloy
Formula:
SnAgCu
Product No.:
50472900
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
50472900ST001 SnAgCu 99.99% Ø 76.2 mm x 3.175 mm Inquire
50472900ST002 SnAgCu 99.99% Ø 76.2 mm x 6.35 mm Inquire
Product ID
50472900ST001
Formula
SnAgCu
Purity
99.99%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
50472900ST002
Formula
SnAgCu
Purity
99.99%
Dimension
Ø 76.2 mm x 6.35 mm

Tin Silver Copper Alloy Sputtering Target Overview

Tin Silver Copper Alloy Sputtering Target is a high-performance alloy target used in sputtering deposition processes for electronic, photovoltaic, and functional coating applications. Combining the unique properties of tin, silver, and copper, this alloy target offers excellent conductivity, thermal stability, and corrosion resistance, making it ideal for advanced thin-film deposition.

We offer SnAgCu sputtering targets in various purity grades and custom sizes. Our technical team is available to assist customers with material selection, performance evaluation, and application development. Please feel free to contact us for any inquiries or technical support.

Product Highlights

Purity: 99.99%
Excellent conductivity: Enhanced electrical and thermal conductivity due to the combined properties of Sn, Ag, and Cu
Corrosion resistance: High resistance to oxidation and corrosion, extending target life in various environments
Thermal stability: Suitable for high-temperature sputtering processes
Customizable sizes: Tailored sizes and shapes to meet specific sputtering system requirements

Applications of Tin Silver Copper Alloy Sputtering Target 

Electronic devices: Used for thin film deposition in the manufacturing of semiconductors, memory devices, and electronic components
Photovoltaic (solar) applications: Ideal for depositing conductive layers and back contacts in solar cells
Functional coatings: Applied in the coating of components in the automotive, aerospace, and optics industries
Catalyst coatings: Utilized in catalyst support coatings for various chemical processes
Nanotechnology: Deposition of thin films for nanostructured materials and devices

Reports

Each shipment of SnAgCu sputtering target is accompanied by:
Certificate of Analysis (COA)
Material Safety Data Sheet (MSDS)
Optional third-party testing reports for enhanced quality assurance

FAQ

Q1: What is the purity of SnAgCu sputtering targets?
A1: We provide 99.9% or higher purity targets, ensuring high-quality and reliable deposition results.

Q2: Can SnAgCu sputtering targets be used in high-temperature applications?
A2: Yes, SnAgCu targets exhibit excellent thermal stability, making them suitable for high-temperature sputtering processes.

Q3: What are the main advantages of using SnAgCu targets over other materials?
A3: SnAgCu targets offer superior electrical conductivity, thermal stability, and corrosion resistance, making them ideal for advanced applications in electronics, photovoltaics, and functional coatings.

Q4: Can you customize the size of SnAgCu sputtering targets?
A4: Yes, we can provide custom sizes and shapes to fit your sputtering system requirements. Please contact us for specific customization details.

Chemical Formula:SnAgCu
Appearance:Silver-gray metallic target
Density:8.7 g/cm³

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

SKU 50472900ST Category Brand:

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