Terbium metal sputtering targets for advanced thin film deposition are high-performance materials designed to meet the stringent requirements of electronic and optical devices. With a purity of up to 99.95%, the target has excellent density and a dense structure, ensuring uniform and stable thin film deposition while forming a dense and firm film layer with extremely low impurity content.
We offer Terbium metal sputtering targets for customized shapes and sizes, including round and rectangular options, tailored to customer process requirements. A complete after-sales service system ensures timely response and support for any technical issues encountered during use, making Terbium metal sputtering targets for high-end device applications a reliable choice for advanced thin film fabrication.
Purity: 99.95%, ensuring the purity of film quality
High density and dense structure to ensure uniform and stable film deposition
Size and shape can be customized according to customer needs, and can be flexibly adapted to various processes
Applicable to magnetic materials, semiconductor devices, optical coatings and other fields
Can support target binding services
Magnetic material preparation: widely used in the deposition of rare earth permanent magnets and magnetic films
Semiconductor process: used for functional film layers to improve device performance and stability
Optical coating: Form high-performance functional films on the surface of special optical components
Research and development: Meet the special needs of scientific research institutions for rare earth metal targets
Each batch of terbium metal sputtering targets comes with an authoritative certificate of analysis (COA), material safety data sheet (MSDS) and related test reports. We support third-party testing to ensure stable and reliable product quality and help customers achieve optimal process performance.
Molecular formula: Tb
Appearance: Silver-grey dense metal target with smooth and uniform surface
Density: about 8.23 g/cm³ (close to theoretical density)
Melting point: about 1,356 °C
Crystal structure: hexagonal close packing (hcp)
Chemical stability: stable in dry air, easy to oxidize and avoid humid environment
Corrosion resistance: has a certain tolerance to general atmospheric environment, stable in inert atmosphere
Signal Word:
Danger
Hazard Statements:
H228: Flammable solid
H260: In contact with water releases flammable gases which may ignite spontaneously
Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.
Outer packaging: Carton or wooden box, depending on size and weight.
Fragile targets: Special protective packaging is used to ensure safe transport.
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