Tantalum Tungsten Alloy sputtering target is a high melting point, high strength sputtering material made of tantalum (Ta) and tungsten (W) alloy, specially developed for thin film deposition processes under harsh conditions. Its excellent thermal stability, corrosion resistance and mechanical strength make it an ideal choice for plasma environments and high temperature processes.
We can provide Tantalum Tungsten Alloy sputtering targets in a variety of shapes and sizes, including round, rectangular or customized, to meet the diverse application needs in scientific research and industry. We also provide comprehensive after-sales technical support to help you efficiently complete material deployment.
Composition: Customizable
Purity: 99.95%
Melting point up to > 3000°C, suitable for high temperature deposition process
Excellent thermal stability and mechanical strength
Strong plasma corrosion resistance, suitable for harsh deposition environment
Size, alloy ratio and back target structure can be customized according to customer needs
Semiconductor device manufacturing: As a diffusion barrier layer or high temperature metal electrode, it has both conductivity and stability
Integrated circuit process: Used as liner and substrate layer in high density interconnect (HDI) or copper interconnect structure
Hard coating preparation: Provide high hardness and corrosion resistance in tool coating and wear-resistant film layer
Optoelectronics and new energy materials: Achieve performance control in special functional thin films and composite target systems
We provide a complete certificate of analysis (COA), material safety data sheet (MSDS) and relevant component test report for each batch of Tantalum Tungsten Alloy alloy targets. We also support third-party agency test reports to ensure data transparency and quality control.
Molecular formula: TaW
Appearance: Silver-grey dense metal target with smooth surface
Density: about 16.5 g/cm³ (close to theoretical density)
Melting point: about 3,170 °C (melting point of alloy, slightly different depending on the ratio of tantalum to tungsten)
Crystal structure: body-centered cubic (BCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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