ULPMAT

Tantalum Silicide

Chemical Name:
Tantalum Silicide
Formula:
TaSi2
Product No.:
731400
CAS No.:
12039-79-1
EINECS No.:
234-902-2
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
731400ST001 TaSi2 99.5% Ø 25.4 mm x 6.35 mm Inquire
731400ST002 TaSi2 99.5% Ø 50.8 mm x 3.175 mm Inquire
731400ST003 TaSi2 99.5% Ø 76.2 mm x 3.175 mm Inquire
731400ST004 TaSi2 99.5% Ø 101.6 mm x 6.35 mm Inquire
731400ST005 TaSi2 99.9% Ø 50.8 mm x 3.175 mm Inquire
731400ST006 TaSi2 99.9% Ø 76.2 mm x 3.175 mm Inquire
731400ST007 TaSi2 99.9% Ø 101.6 mm x 6.35 mm Inquire
731400ST008 TaSi2 99.99% Ø 50.8 mm x 3.175 mm Inquire
731400ST009 TaSi2 99.99% Ø 76.2 mm x 3.175 mm Inquire
Product ID
731400ST001
Formula
TaSi2
Purity
99.5%
Dimension
Ø 25.4 mm x 6.35 mm
Product ID
731400ST002
Formula
TaSi2
Purity
99.5%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
731400ST003
Formula
TaSi2
Purity
99.5%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
731400ST004
Formula
TaSi2
Purity
99.5%
Dimension
Ø 101.6 mm x 6.35 mm
Product ID
731400ST005
Formula
TaSi2
Purity
99.9%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
731400ST006
Formula
TaSi2
Purity
99.9%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
731400ST007
Formula
TaSi2
Purity
99.9%
Dimension
Ø 101.6 mm x 6.35 mm
Product ID
731400ST008
Formula
TaSi2
Purity
99.99%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
731400ST009
Formula
TaSi2
Purity
99.99%
Dimension
Ø 76.2 mm x 3.175 mm

Tantalum Silicide sputtering targets Overview

Tantalum Silicide sputtering targets are high-performance materials designed for thin film deposition processes. With a purity of up to 99.99%, they have excellent thermal and chemical stability, ensuring uniform film formation, good adhesion and low impurity content.

We offer Tantalum Silicide sputtering targets in a variety of specifications and sizes, including round and rectangular, and can be customized to your specific needs. We also provide comprehensive after-sales support – if you have any questions during use, please feel free to contact us.

Product highlights

Purity: 99.99%
Excellent thermal and chemical stability
High density to ensure uniform film deposition
Customizable size and shape
Target bonding is available
Applicable to semiconductor, optoelectronic and high-temperature coating fields

Applications of Tantalum Silicide sputtering target

Semiconductors: Used to manufacture thin film layers of high-performance electronic devices to improve device stability and performance.
Optoelectronic devices: Suitable for the manufacture of optical film layers and sensor elements.
High-temperature coatings: Provide excellent performance in wear-resistant and high-temperature resistant coatings.
Functional thin films: Applied to corrosion-resistant and wear-resistant protective film layers.

Reports

Each batch of products comes with a Certificate of Analysis (COA), Material Safety Data Sheet (MSDS) and related quality reports. We also support third-party testing to ensure that product quality meets customer standards.

Molecular formula: TaSi₂
Molecular weight: about 182.84 g/mol
Appearance: dark gray dense target with smooth surface
Density: about 9.4 g/cm³ (close to theoretical density)
Melting point: about 2,850 °C
Crystal structure: hexagonal system

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

SKU 731400ST Category Brand:

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