Tantalum metal ring targets (Ta) are high-performance sputtering materials known for their excellent corrosion resistance, high melting point (3017°C), and outstanding film uniformity. These targets are widely used in semiconductor fabrication, optical coatings, and thin-film deposition for high-end electronic and photonic devices.
We provides high-purity tantalum ring targets 99.99% with customized dimensions and precise microstructure control to ensure consistent sputtering performance and long target life.
Exceptional Film Uniformity: Fine-grained microstructure ensures homogeneous sputtering rates.
High Thermal and Chemical Stability: Stable under high-temperature and high-vacuum environments.
Low Oxygen and Impurity Content: Improves adhesion and reduces film defects.
Custom Engineering Support: Tailored target designs for magnetron sputtering systems.
Long Service Life: Optimized density and mechanical strength minimize erosion and cracking.
Semiconductor Industry: Diffusion barriers, capacitor electrodes, and interconnect layers.
Optoelectronics: Optical coatings for high-reflectivity and anti-corrosion films.
Aerospace and Energy: Functional coatings for high-performance structural components.
Research and Development: Advanced materials research, nanostructured film synthesis.
Every batch of ULPMAT’s tantalum ring targets is supplied with:
Grain size and density inspection data
Surface finish and flatness test results
Optional: GDMS trace impurity analysis and film uniformity testing
Chemical Formula：Ta
Molecular Weight ：180.9479 g/mol
Purity：99.99% (available)
Density:16.65 g/cm³
Melting Point:3017 °C
Boiling Point:5458 °C
Crystal Structure:Body-Centered Cubic (BCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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