ULPMAT

Silver metal

Chemical Name:
Silver metal
Formula:
Ag
Product No.:
4700
CAS No.:
7440-22-4
EINECS No.:
231-131-3
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
4700ST001 Ag 99.99% Ø 50.8 mm x 3.175 mm Inquire
4700ST002 Ag 99.99% Ø 50.8 mm x 6.35 mm Inquire
4700ST003 Ag 99.99% Ø 75 mm x 5 mm Inquire
4700ST004 Ag 99.99% Ø 76.2 mm x 6.35 mm Inquire
4700ST005 Ag 99.99% Ø 101.6 mm x 6.35 mm Inquire
4700ST006 Ag 99.999% Ø 50.8 mm x 3.175 mm Inquire
4700ST007 Ag 99.999% Ø 76.2 mm x 3.175 mm Inquire
4700ST008 Ag 99.999% Ø 101.6 mm x 6.35 mm Inquire
Product ID
4700ST001
Formula
Ag
Purity
99.99%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
4700ST002
Formula
Ag
Purity
99.99%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
4700ST003
Formula
Ag
Purity
99.99%
Dimension
Ø 75 mm x 5 mm
Product ID
4700ST004
Formula
Ag
Purity
99.99%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
4700ST005
Formula
Ag
Purity
99.99%
Dimension
Ø 101.6 mm x 6.35 mm
Product ID
4700ST006
Formula
Ag
Purity
99.999%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
4700ST007
Formula
Ag
Purity
99.999%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
4700ST008
Formula
Ag
Purity
99.999%
Dimension
Ø 101.6 mm x 6.35 mm

Silver metal sputtering target Overview

Silver metal sputtering targets are high-purity metallic materials with excellent electrical and thermal conductivity, and are easily and uniformly sputtered into films. They are widely used in the fabrication of electronic components, optical thin films, sensors, solar energy devices, and other high-precision industrial thin films.

We offer silver metal sputtering targets in various specifications, sizes, and thicknesses, and support custom processing and special surface treatments to meet the diverse needs of our customers in scientific research and industrial production. Please contact our professional team for high-quality solutions.

Product Highlights

High purity guaranteed (99.999%)
Uniform and dense structure for high sputtering efficiency
Excellent electrical and thermal conductivity
Can be processed into various shapes and sizes
Smooth surface, free of pores and cracks
Target bonding services available
Suitable for DC and RF sputtering
Customized production to meet special process requirements

Applications of Silver metal sputtering target

Used for sputtering fabrication of thin films in electronic devices and semiconductors.
As a conductive thin film material in solar cells and photovoltaic devices.
Suitable for conductive layer deposition in high-performance sensors.
Used for the fabrication of optical reflective films and decorative metal films.

FAQs

Q1: How is the silver sputtering target packaged and shipped?
A1: Shockproof and moisture-proof packaging is used, secured with foam or wooden crates to ensure the target is not damaged during transportation.

Q2: Can the purity and specifications of the silver target be customized?
A2: Yes, purity is available from 99.99% to 99.999%, and size and thickness can be customized according to customer process requirements.

Q3: How should the sputtering target be stored to maintain its performance?
A3: Please store it in a dry, cool, and dark environment, avoiding contact with corrosive chemicals and high humidity air.

Q4: What after-sales services does your company provide?
A4: We provide technical support, customized processing, bulk supply, target performance tracking, and rapid problem response services.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We specialize in the research and supply of high-purity silver metal sputtering targets, strictly controlling target purity, density, and surface smoothness to ensure uniform and stable sputtering films. Choosing us means receiving reliable product performance, customized services, and professional technical support, making us a premium partner for electronics manufacturing, optical thin films, and high-precision industrial applications.

Chemical Formula: Ag
Molecular Weight: 107.87 g/mol
Appearance: Thin, silvery-white foil with a metallic luster
Density: 10.49 g/cm³
Melting Point: 961.8 °C
Boiling Point: 2,162 °C
Crystal Structure: Face-centered cubic (FCC)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

Documents

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