ULPMAT

Silver Copper Alloy

Chemical Name:
Silver Copper Alloy
Formula:
AgCu
Product No.:
472900
CAS No.:
EINECS No.:
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
472900ST001 AgCu 99.99% Ø 75 mm x 6 mm Inquire
Product ID
472900ST001
Formula
AgCu
Purity
99.99%
Dimension
Ø 75 mm x 6 mm

Silver Copper Alloy Sputtering Target Overview

Silver Copper Alloy sputtering targets are functional thin-film materials that combine the excellent conductivity of silver with the mechanical stability of copper. They are commonly used in the fabrication of electronic packaging, conductive layers, wear-resistant films, and optical films. Their balanced electrical, thermal, and structural properties make them a popular material in high-reliability thin-film processes, suitable for both research and industrial production equipment.

We offer high-purity AgCu alloy targets, supporting different silver-copper ratios, sizes, shapes, and backplane soldering services. For a quick quote or technical consultation, please contact us.

Product Highlights

High conductivity and good mechanical stability alloy combination
Smooth surface finish, low-particle sputtering
Excellent film uniformity, compatible with various magnetron sputtering equipment
Supports various ratios and custom sizes
Offers backplane diffusion soldering and brazing services
Strong batch supply capacity, stable production cycle

Applications of Silver Copper Alloy Sputtering Target

Used for conductive film and contact layer deposition in electronic products.
Suitable for industrial coating processes of wear-resistant and protective films. Used as reflective or electro-optical coatings in optical systems.
Used as high-reliability metal transition layers in encapsulation technology.

FAQs

Q1: What is the packaging method for AgCu sputtering targets?
A1: We use vacuum-sealed bags with pearl cotton cushioning and a sturdy shockproof outer box to ensure the target is not damaged or oxidized during transportation.

Q2: What are the main advantages of this alloy target?
A2: AgCu targets combine high conductivity, good adhesion, mechanical durability, and stable sputtering rates, making them suitable for applications requiring high film quality.

Q3: Can the target be reprocessed or customized in size?
A3: Yes, we support customers providing drawings or requirements for various personalized customizations such as processing, polishing, backplate welding, and adjusting the mix ratio.

Q4: What precautions should be taken when storing the target?
A4: It is recommended to store it in a dry, light-protected environment in a sealed container and avoid prolonged exposure to humid air to ensure the silver-copper alloy surface remains stable.

Reports

Each batch is supplied with:

Certificate of Analysis (COA)

Technical Data Sheet (TDS)

Material Safety Data Sheet (MSDS)

Third-party testing reports available upon request

Why Choose Us?

We employ advanced vacuum melting technology and uniform pressing processes to ensure that our Silver Copper Alloy sputtering targets possess high purity, high density, and stable sputtering performance. Our company has a mature quality control system and supports comprehensive customized processing services, including formulation design, target structure optimization, and backplate welding. Our global clients include research institutions, semiconductor manufacturers, and thin film material companies, enabling us to provide stable, fast, and reliable supply chain support.

Chemical formula: AgCu
Appearance: Dense target material with a silver-gray or dark gray metallic luster

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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