Silicon Dioxide Wafer is a high-purity silicon oxide sheet with excellent thermal stability, chemical inertness, and surface flatness. It is widely used in semiconductor manufacturing, microelectronic devices, and optical thin film deposition.
We offer SiO2 wafers in various specifications and support technical integration for size, thickness, and process matching. Contact us now!
High thermal stability and chemical inertness
Smooth surface with high flatness
Customizable size and thickness
Suitable for semiconductor and optical thin film processes
Strong process compatibility
Semiconductor Device Manufacturing: SiO₂ wafers can be used as substrates or insulating materials for electronic devices, improving device performance and reliability.
Microelectronic Thin Film Deposition: Used for microelectronic thin film preparation, ensuring film adhesion and thickness uniformity.
Optical Thin Film Applications: Suitable for the preparation of optical functional films, anti-reflective films, and transparent conductive films.
Research and Process Validation: Supports research on new materials and thin film processes, validating deposition parameters and process effects.
Q1: What processes can SiO₂ wafers be used in?
A1: Primarily used in semiconductor device manufacturing, microelectronic thin film deposition, and optical thin film fabrication.
Q2: Are silicon oxide wafers stable in high-temperature processes?
A2: SiO₂ wafers have high thermal stability and can maintain their structure and performance in high-temperature processes.
Q3: Does the surface flatness of the wafer affect the application?
A3: High flatness ensures uniform thin film deposition and consistent device performance.
Q4: Can SiO₂ wafers be used directly for thin film deposition?
A4: Yes, suitable for substrates used in semiconductor and optical functional thin film deposition.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We have extensive experience in the silicon oxide wafer supply field and can provide highly stable, traceable SiO₂ wafers to support customers in achieving consistency and reliability in thin film deposition and device manufacturing during the R&D and application stages.
Molecular Formula: SiO2
Molecular Weight: 60.08 g/mol
Appearance: White wafer
Density: 2.65 g/cm³
Melting Point: 1710 °C
Boiling Point: 2230 °C
Crystal Structure: Tetragonal/Hexagonal (quartz)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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