ULPMAT

Silicon Dioxide

Chemical Name:
Silicon Dioxide
Formula:
SiO2
Product No.:
140801
CAS No.:
14808-60-7
EINECS No.:
238-878-4
Form:
Ring Target
HazMat:
Product ID Formula Purity Dimension Inquiry
140801RT001 SiO2 99.99% OD355.6mm x ID203.2mm x 6.35mm Inquire
140801RT002 SiO2 99.99% OD304.8mm x ID22.86mm x9.525mm Inquire
Product ID
140801RT001
Formula
SiO2
Purity
99.99%
Dimension
OD355.6mm x ID203.2mm x 6.35mm
Product ID
140801RT002
Formula
SiO2
Purity
99.99%
Dimension
OD304.8mm x ID22.86mm x9.525mm

Silicon Dioxide Ring Target Overview

Silicon Dioxide Ring Target is a high-purity ceramic ring target designed specifically for magnetron spin sputtering systems, ensuring uniformity and process stability in thin film deposition. It is widely used in the preparation of optical thin films, electronic devices, and protective coatings.

We offer SiO2 Ring Targets compatible with various spin sputtering systems and support technical integration for target size, structure, and deposition parameters. Contact us now!

Product Highlights

Ring design, suitable for spin sputtering systems
High thermal stability
High thin film deposition uniformity
Strong process compatibility
Stable batches, good consistency

Applications of Silicon Dioxide Ring Target

Optical Thin Film Deposition: SiO₂ ring targets can be used to prepare transparent films, anti-reflective films, and other optically functional thin films.
Electronic Device Functional Layers: Suitable for the deposition of functional layers in semiconductors and electronic devices, improving device performance consistency.
Protective Coatings: Used to prepare corrosion-resistant and protective thin films, enhancing material surface properties.
Research and Process Optimization: Supports research on novel thin film processes and the optimization and verification of spin sputtering parameters.

FAQs

Q1: What sputtering applications are suitable for SiO₂ ring targets?
A1: Primarily used for spin sputtering deposition of optical thin films, functional layers for electronic devices, and protective coatings.

Q2: What are the advantages of ring targets compared to planar targets?
A2: Ring target design is suitable for spin sputtering systems, improving film thickness uniformity and material utilization.

Q3: Are SiO₂ ring targets stable during high-temperature deposition?
A3: The high-purity ceramic material ensures that the target maintains structural and deposition stability under high-temperature conditions.

Q4: Does the ring target design affect film performance?
A4: A well-designed ring shape contributes to uniform deposition, improving film thickness and compositional consistency.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We have mature supply and technical experience in the field of ceramic rotating targets, and can provide stable and traceable Silicon Dioxide Ring Targets to help customers achieve high uniformity and reliability of thin film deposition in rotating sputtering systems.

Molecular Formula: SiO2
Molecular Weight: 60.08 g/mol
Appearance: White ring-shaped target
Density: 2.2–2.65 g/cm³ (sintered target)
Melting Point: 1710 °C
Boiling Point: 2230 °C
Crystal Structure: Tetragonal/Hexagonal (quartz); Amorphous (sintered target)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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