Silicon Aluminum Zirconium Alloy Rotary Target is a rotating multi-element alloy target for continuous sputtering processes. Combining the properties of silicon, aluminum, and zirconium, it achieves highly stable thin film deposition. It is widely used in display panel metal layers, semiconductor functional layers, thin-film circuits, and large-area functional coating deposition.
We can provide silicon aluminum zirconium alloy rotating targets of different sizes, interfaces, and structures according to customer equipment requirements, supporting process matching and technology integration. Please contact us directly for solutions.
Rotating structure improves target utilization
Good sputtering stability of multi-element alloy
Excellent film uniformity and consistent thickness
Stable continuous deposition over long periods
Excellent thermal management and cooling effect
Customizable size, interface, and structure
Display Panel Metal Thin Film Deposition: Suitable for large-area metal or functional layer deposition in display devices, ensuring film uniformity and stable electrical properties.
Semiconductor Functional Layer Deposition: In semiconductor device manufacturing, multi-alloy rotating targets provide stable metal thin film deposition, ensuring consistent device performance.
Thin Film Circuits and Functional Coatings: Suitable for continuous deposition processes of thin film circuits, electrical functional layers, and protective coatings, ensuring film density and stability.
Research and Process Development: Widely used in experimental research and process optimization of rotating sputtering systems, providing a material basis for the development of novel multi-alloy thin films.
Q1: What is the difference between a Silicon Aluminum Zirconium Alloy Rotary Target and a conventional alloy rotating target?
A1: Multi-alloy rotating targets offer superior film stability and thin film performance control, meeting the demands of applications with higher conductivity and mechanical performance requirements.
Q2: How is heat management ensured during the sputtering process?
A2: The rotating target, combined with a cooling system, effectively disperses the heat generated during sputtering, maintaining target stability.
Q3: Which sputtering processes are suitable for this type of multi-alloy rotating target?
A3: Suitable for DC, RF, and other common physical vapor deposition processes; specific adjustments can be made based on equipment.
Q4: How to achieve uniform and consistent thin film deposition?
A4: By properly controlling power, rotation speed, and atmosphere conditions, uniform, dense, and stable thin film deposition can be achieved.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in application-oriented supply of multi-alloy rotary sputtering targets, emphasizing target structure design and equipment compatibility, providing customers with stable and reliable thin film deposition solutions and efficient technical support.
Molecular Formula: SiAlZr
Appearance: Silver-gray dense rotating target tube
Density: 2.4–2.8 g/cm³ (depending on alloy ratio and sintering process)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
