| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 141300ST001 | SiAl (90/10wt%) | 99.9% | Ø 50.8mm x 3.175 mm | Inquire |
| 141300ST002 | SiAl (90/10wt%) | 99.9% | Ø 76.2mm x 3.175 mm | Inquire |
| 141300ST003 | SiAl (90/10wt%) | 99.9% | Ø 101.6mm x 6.35 mm | Inquire |
| 141300ST004 | SiAl (70/30wt%) | 99.9% | Ø 50.8mm x 3.175 mm | Inquire |
| 141300ST005 | SiAl (70/30wt%) | 99.9% | Ø 76.2mm x 3.175 mm | Inquire |
| 141300ST006 | SiAl (70/30wt%) | 99.9% | Ø 101.6mm x 6.35 mm | Inquire |
| 141300ST007 | SiAl (50/50wt%) | 99.9% | Ø 22mm x 13 mm | Inquire |
| 141300ST008 | SiAl (50/50wt%) | 99.9% | Ø 22mm x 15 mm | Inquire |
| 141300ST009 | SiAl (50/50wt%) | 99.9% | Ø C | Inquire |
| 141300ST010 | SiAl (90/10wt%) | 99.9% | 345mm x 145mm x 8mm | Inquire |
| 141300ST011 | SiAl (50/50wt%) | 99.9% | 600mm x 120mm x 4mm | Inquire |
Silicon Aluminum Alloy sputtering targets are metal targets based on silicon-aluminum alloys, commonly used to prepare functional thin films with conductivity and stability. They are widely used in semiconductor interconnect layers, display panels, thin-film circuits, and related functional coatings.
We offer silicon-aluminum alloy sputtering targets in various structures and sizes, supporting equipment matching and process communication. Please contact us directly for solutions and quotations.
Stable alloy structure
Controllable sputtering rate
Good film uniformity
Suitable for metal interconnect processes
Strong equipment compatibility
Custom sizes and structures supported
Semiconductor Interconnects and Conductive Thin Films: Commonly used for depositing conductive and interconnect thin films, balancing conductivity and process stability in device manufacturing.
Displays and Thin-Film Circuits: Suitable for preparing functional metal layers in display panels and thin-film circuits, meeting large-area deposition requirements.
Electronic Packaging and Functional Layers: In electronic packaging and related functional layers, silicon-aluminum alloy thin films can be used to improve structural reliability and electrical consistency.
Research and Process Validation: Widely used in laboratory sputtering systems and pilot-scale equipment for research on novel alloy thin films and process parameters.
Q1: Which sputtering processes are suitable for Silicon Aluminum Alloy sputtering targets?
A1: They can be used in common physical vapor deposition processes such as DC sputtering and RF sputtering, depending on the equipment configuration.
Q2: Is the film formed on a silicon-aluminum alloy target stable during sputtering?
A2: Under appropriate power and atmosphere conditions, alloy targets help obtain thin films with relatively uniform composition and thickness.
Q3: Are there any requirements for equipment cooling when using silicon-aluminum alloy targets?
A3: Metal alloy targets generally require good cooling conditions to maintain the continuity and stability of the sputtering process.
Q4: Which application scenarios are silicon-aluminum alloy targets more suitable for?
A4: Suitable for electronic and display-related applications that require high conductivity, film uniformity, and process compatibility.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in application-oriented supply of alloy sputtering targets, emphasizing the compatibility and sputtering stability of targets in actual equipment. We can provide customers with reliable products and efficient technical support.
Molecular formula: SiAl
Appearance: Silver-gray dense target block
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
