| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 141300RT001 | SiAl (90/10wt%) | 99.9% | ID125mm x OD133mm x 850mm, 6 mm Th | Inquire |
| 141300RT002 | SiAl (70/30wt%) | 99.9% | ID125mm x OD133 x 1600mm,6 mm Th | Inquire |
| 141300RT003 | SiAl (50/50wt%) | 99.9% | ID125mm x OD133 x 1600mm,6 mm Th | Inquire |
Silicon Aluminum Alloy Rotary Target is a rotating alloy target for continuous sputtering processes, combining the properties of silicon-aluminum alloys with the advantages of a rotating target structure. It is primarily used in display panels, semiconductor metal layers, thin-film circuits, and large-area functional coating deposition.
We can provide silicon-aluminum alloy rotating targets of different sizes and interface types according to the cathode structure of the equipment. We support process integration and technical communication. Please contact us directly for solutions.
Rotating sputtering, high target utilization
Good alloy sputtering stability
Excellent film uniformity
Suitable for long-term continuous operation
Facilitates heat dissipation and cooling
Customized structure and size supported
Display Panel Metal Thin Films: Suitable for deposition of conductive or functional metal layers in display panels, meeting the requirements for large-area uniform film deposition.
Semiconductor Metal Layer Deposition: In semiconductor device manufacturing, the rotating target structure helps improve sputtering stability and film uniformity.
Thin-Film Circuits and Functional Coatings: Suitable for the preparation of thin-film circuits and related functional coatings, supporting stable operation under continuous process conditions.
Research and Process Optimization: Widely used in process parameter research and novel alloy thin film development in spinning sputtering systems.
Q1: What are the advantages of a silicon aluminum alloy rotary target compared to a planar alloy target?
A1: A rotating target, through continuous participation in sputtering, can improve target utilization and enhance the uniformity of large-area thin films.
Q2: What are the requirements for the cooling system when using a silicon aluminum alloy rotary target?
A2: Rotating targets are typically used in conjunction with internal cooling structures to help maintain the stability of the sputtering process.
Q3: What sputtering methods are suitable for silicon aluminum alloy rotary targets?
A3: They can be used in common metal target sputtering processes such as DC sputtering, depending on the equipment configuration.
Q4: How to maintain stable film composition during sputtering?
A4: Appropriate control of power, atmosphere, and rotation parameters helps to obtain stable and consistent film performance.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in application-oriented supply of alloy spinning sputtering targets, emphasizing target structural design and equipment compatibility. We can provide customers with stable and reliable product solutions and efficient technical support.
Molecular Formula: SiAl
Appearance: Dense, silver-gray rotating target tube
Density: 2.3–2.7 g/cm³ (depending on alloy ratio and sintering process)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
