| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 2800ST001 | Ni | 99.99% | Ø 25.4 mm x 0.5 mm | Inquire |
| 2800ST002 | Ni | 99.99% | Ø 25.4 mm x 3.175 mm | Inquire |
| 2800ST003 | Ni | 99.99% | Ø 50.8 mm x1 mm | Inquire |
| 2800ST004 | Ni | 99.99% | Ø 50.8 mm x 3.175 mm | Inquire |
| 2800ST005 | Ni | 99.99% | Ø 50.8 mm x 6.35 mm | Inquire |
| 2800ST006 | Ni | 99.99% | Ø 76.2 mm x 3.175 mm | Inquire |
| 2800ST007 | Ni | 99.99% | Ø 76.2 mm x 6.35 mm | Inquire |
| 2800ST008 | Ni | 99.99% | Ø 101.6 mm x 3.175 mm | Inquire |
| 2800ST009 | Ni | 99.99% | Ø 150 mm x 2 mm | Inquire |
| 2800ST010 | Ni | 99.99% | Ø 152.4 mm x 3.175 mm | Inquire |
| 2800ST011 | Ni | 99.99% | Ø 152.4 mm x 6.35 mm | Inquire |
| 2800ST012 | Ni | 99.99% | 300 mm x 100 mm x 4 mm | Inquire |
| 2800ST013 | Ni | 99.99% | 508 mm x 127 mm x 2 mm | Inquire |
Nickel sputtering targets are high-purity metallic materials used in physical vapor deposition (PVD) processes, primarily for functional thin film fabrication and surface engineering.
We offer nickel sputtering targets in various specifications, densities, and purity grades, and support customized sizes and technical consultations. Please contact us for customized solutions.
Stable purity control
High target density
Uniform sputtering process
Good film repeatability
Excellent discharge stability
Compatible with various equipment
Semiconductor and Microelectronic Thin Films: In microelectronics manufacturing, nickel-based thin films are commonly used for conductive or functional layer fabrication. Target stability helps achieve consistent film thickness and performance.
Magnetic and Functional Coatings: Nickel-related thin films are widely used in magnetic and functional coatings. Sputtering processes can achieve coatings with uniform structure and good adhesion.
Surface Engineering and Protective Coatings: In the field of wear-resistant or corrosion-resistant coatings, nickel targets can be used to form dense protective layers, extending the service life of the substrate.
Scientific Research and Process Development: Nickel metal sputtering targets are suitable for laboratory thin film research and process parameter exploration, meeting the requirements for repeatability and stability in the R&D stage.
Q1: Which deposition processes are nickel metal sputtering targets suitable for?
A1: Primarily used in physical vapor deposition (PVD) processes, compatible with various common sputtering equipment.
Q2: Does the density of the target affect the performance?
A2: Density has a significant impact on sputtering stability and film uniformity. High-density targets are more beneficial for continuous use.
Q3: Can targets be customized according to equipment size?
A3: Yes, we support customized processing of different sizes, thicknesses, and structures.
Q4: What precautions should be taken when storing targets?
A4: It is recommended to store them in a sealed container, avoiding humid environments and surface contamination to maintain material stability.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We have long focused on the preparation and supply of sputtering targets, emphasizing raw material selection, process control, and quality stability. Through clear technical documentation and flexible customization capabilities, we help customers reduce uncertainties in the thin film preparation process.
Molecular Formula: Ni
Molecular Weight: 58.69 g/mol
Appearance: Silvery-white metallic target, smooth surface, round or rectangular
Density: 8.90 g/cm³
Melting Point: 1455°C
Boiling Point: 2913°C
Crystal Structure: Face-centered cubic crystal structure
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
