Nickel metal rotary targets are high-purity metal targets used in continuous sputtering deposition processes, suitable for large-area thin film preparation and industrial production applications.
We offer nickel metal rotary targets of various lengths, diameters, and bonding structures, and support technical verification for equipment compatibility. Contact us for customized solutions.
Suitable for continuous sputtering operation
High target utilization
Good discharge stability
Excellent film uniformity
Reliable structural strength
Adaptable to mass production processes
Large-area functional thin film preparation: In architectural glass or industrial coatings, nickel metal rotary targets support stable deposition over long periods, contributing to the acquisition of functional thin films with uniform thickness.
Electronics and semiconductor manufacturing: In electronic device production, the rotary target structure is suitable for high-cycle process requirements, improving production efficiency and reducing downtime.
Surface engineering and protective coatings: Nickel-based rotary targets can be used to form wear-resistant or corrosion-resistant coatings, suitable for continuous coating surface engineering applications.
Research and Process Scale-up Validation: Nickel metal rotating targets are also suitable for process scale-up validation from experimental to pilot-scale stages, facilitating the evaluation of thin film performance under continuous deposition conditions.
Q1: What are the advantages of rotating targets compared to planar targets?
A1: Rotating targets have higher utilization rates, are suitable for long-term continuous sputtering, and can effectively improve production efficiency.
Q2: Which equipment is compatible with nickel metal rotating targets?
A2: Size and structure can be customized according to different sputtering systems to meet equipment installation requirements.
Q3: Does a rotating target affect thin film uniformity?
A3: The rotating structure helps to uniformly consume the target material, thereby improving the consistency of thin film deposition.
Q4: What precautions should be taken during product transportation and storage?
A4: It is recommended to use shockproof and moisture-proof packaging, and avoid contamination or mechanical damage to the target surface.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We possess mature experience in the preparation and delivery of spin sputtering targets, enabling us to provide customized solutions highly compatible with our equipment while ensuring target stability, helping customers achieve efficient and sustainable thin film production.
Molecular Formula: Ni
Molecular Weight: 58.69 g/mol
Appearance: Silvery-white metallic disk with a smooth surface, commonly round or custom-shaped
Density: 8.90 g/cm³
Melting Point: 1455°C
Boiling Point: 2913°C
Crystal Structure: Face-centered cubic crystal structure
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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