| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 282600ST001 | NiFe (80/20wt%) | 99.95% | Ø 50.8 mm x 3.175 mm | Inquire |
| 282600ST002 | NiFe (80/20wt%) | 99.95% | Ø 76.2 mm x 3.175 mm | Inquire |
| 282600ST003 | NiFe (50/50wt%) | 99.95% | Ø 100 mm x 1 mm | Inquire |
| 282600ST004 | NiFe (80/20wt%) | 99.95% | Ø 101.6 mm x 2 mm | Inquire |
| 282600ST005 | NiFe (80/20wt%) | 99.95% | Ø 101.6 mm x 3.175 mm | Inquire |
| 282600ST006 | NiFe (80/20wt%) | 99.95% | Ø 203.2 x 3.175 mm | Inquire |
| 282600ST007 | NiFe (50/50wt%) | 99.95% | 170mm x 58mm x 1mm | Inquire |
Nickel iron alloy sputtering targets are alloy targets used in thin film deposition processes, primarily in the manufacture of magnetic functional thin films and related devices.
We can provide nickel iron alloy sputtering targets in various specifications to meet different sputtering equipment and thin film requirements. Custom processing is supported. Please contact us for detailed information.
Controllable alloy ratio
Uniform microstructure
Stable thin film composition
Compatible with various sputtering equipment
High target density
Stable operation
Magnetic Functional Thin Film Preparation: Commonly used for depositing soft magnetic or functional magnetic thin films, suitable for applications requiring high consistency and repeatability of magnetic response.
Semiconductor and Microstructure Devices: Used in some semiconductor processes and microstructure devices to form key metal or alloy functional layers, meeting process stability requirements.
Electronics and Electromagnetic Materials: Can be used to prepare thin film structures with specific electromagnetic properties, applied in electromagnetic control and related functional materials fields.
Research and Process Validation: Suitable for experimental use by research institutions and R&D departments in novel alloy thin films, process window exploration, and parameter validation.
Q1: Which sputtering processes are suitable for nickel-iron alloy sputtering targets?
A1: They can be used in conventional DC sputtering and magnetron sputtering processes. Specific process conditions need to be set in conjunction with equipment parameters.
Q2: Can the nickel-iron ratio of the target be adjusted?
A2: Yes, alloy solutions with different composition ratios can be provided according to the thin film performance targets.
Q3: How stable is the target during long-term use?
A3: Under reasonable power and cooling conditions, the target structure is stable, which helps maintain the consistency of the deposition process.
Q4: Do you support small sizes or non-standard specifications?
A4: Yes, we can meet the size and shape requirements of the R&D stage or special equipment.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We have long focused on the preparation and processing of alloy sputtering targets, emphasizing composition control, structural stability, and process matching, enabling us to provide customers with more reliable thin film deposition material support.
Molecular formula: NiFe
Appearance: Metallic luster, silvery-white or gray target material, smooth surface
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
