Lutetium metal sputtering targets for thin film deposition are high-performance materials designed for high-precision thin film coating processes. With a purity of up to 99.9%, these high-purity Lutetium sputtering targets offer excellent density and uniform microstructure, ensuring the stability, compactness, and outstanding adhesion of the deposited film. Our vacuum-grade Lutetium metal sputtering targets effectively reduce impurity content, meet strict semiconductor and optical coating process requirements, and are ideal for use in electronics, photonics, and advanced materials research.
We provide customized high-purity lutetium in a variety of sizes and shapes, including round and rectangular, which can be produced according to customer needs. Equipped with comprehensive technical support and after-sales service, we help customers solve various problems in thin film coating and deposition applications using lutetium sputtering targets.
High density, ensuring uniform and dense film deposition
Customizable size and shape to meet the needs of different equipment
Target binding service available
Full technical support available
Semiconductor: used for thin film deposition of high-performance devices, providing excellent electrical and optical properties
Laser materials: key materials for lutetium-based laser crystals and functional films
Optoelectronic devices: functional film deposition in LEDs, optical fibers and optical sensors
High-end coatings: used for the preparation of wear-resistant, corrosion-resistant and special functional films
We provide detailed certificates of analysis (COA), material safety data sheets (MSDS) and other test reports for each batch of lutetium sputtering targets, and support third-party testing to ensure transparent and reliable product quality. Please contact us for more technical information.
Chemical formula: Lu
Appearance: Silvery white to grayish white metal with metallic luster
Density: 9.84 g/cm³ (high-density rare earth metal)
Melting point: 1663 °C
Boiling point: 3400 °C
Thermal conductivity: 16.4 W/m·K
Electrical conductivity: 1.79 × 10⁷ S/m
Specific heat capacity: 0.154 J/g·K
Coefficient of thermal expansion: 9.9 × 10⁻⁶ /K
Crystal structure: Hexagonal close packing (HCP)
Magnetic properties: Paramagnetic
Corrosion resistance: Moderate; stable in dry air, but easily oxidized in humid environments
Chemical reactivity: Sensitive to acids, especially dilute sulfuric acid and nitric acid, slowly reacts with water to produce hydrogen
Signal Word:
Danger
Hazard Statements:
H228: Flammable solid
H260: In contact with water releases flammable gases which may ignite spontaneously
Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.
Outer packaging: Carton or wooden box, depending on size and weight.
Fragile targets: Special protective packaging is used to ensure safe transport.
If you need any service, please contact us
