ULPMAT

Iron Titanium Oxide (Ilemnite)

Chemical Name:
Iron Titanium Oxide (Ilemnite)
Formula:
FeTiO3
Product No.:
26220800
CAS No.:
12022-71-8
EINECS No.:
234-667-6
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
26220800ST001 FeTiO3 99.9% Ø 50.8 mm x 3.175 mm Inquire
Product ID
26220800ST001
Formula
FeTiO3
Purity
99.9%
Dimension
Ø 50.8 mm x 3.175 mm

Iron Titanium Oxide Sputtering Targets Overview

Iron titanium oxide sputtering targets are key ceramic targets used in physical vapor deposition (PVD) processes. Through advanced technologies such as magnetron sputtering, they can deposit composite oxide thin films with stable and uniform composition on substrates. These films play important functional roles in high-tech fields such as semiconductors, optical coatings, sensors, and surface engineering.

We professionally provide a series of high-purity, high-density iron titanium oxide sputtering targets, supporting customization in various specifications, including planar and rotating targets, to meet your specific needs in different application scenarios and coating equipment. Please contact us if you require a detailed product specification sheet.

Product Highlights

Strictly controlled stoichiometry
Ultra-high purity, extremely low impurity content
High density and excellent microstructure uniformity
Stable sputtering performance and film formation rate
Supports reactive sputtering and mid-frequency sputtering processes
Provides end-to-end quality control from raw materials to finished products

Applications of Iron Titanium Oxide Sputtering Targets

Advanced Optical Coating: Targets are used to deposit high-performance optical thin films on substrates such as glass, including anti-reflective films, low-emissivity (LOW-E) films, and solar control films. These effectively regulate light transmittance and reflectance, improving the performance of architectural glass and optical components.

Semiconductors and Functional Devices: Deposited iron titanium oxide thin films can be used to prepare specific functional layers, such as dielectric or sensitive layers in semiconductor devices, applied in microelectronics and sensor fields.

Surface Protection and Modification Coatings: Through sputtering processes, a dense, hard oxide protective coating can be formed on the surface of tools, molds, or critical components, significantly improving their wear resistance, corrosion resistance, and service life.

Cutting-Edge Scientific Research and New Material Development: As crucial experimental materials, they serve the exploration and research of novel functional thin films, catalytic materials, and energy materials (such as photoelectrocatalysis), providing a material foundation for technological innovation.

FAQs

Q1: What is the typical purity level of iron titanium oxide targets?
A1: The purity of our products can be customized according to application requirements, reaching up to 99.9%. The content of key impurity elements is controlled at extremely low levels to meet the stringent requirements of semiconductor or optical coating processes.

Q2: How do I select the appropriate target size and shape for my coating equipment?
A2: We offer a variety of standardized shapes, including planar and rotating targets, and accept custom sizes. Simply provide the equipment model or specific drawings and technical requirements, and our technical team will recommend or design the most suitable product solution for you.

Q3: How long is the production cycle for ordering a non-standard composition or special specification target?
A3: The customization cycle depends on the complexity of the formulation and the processing difficulty. For adjustments based on mature processes, it usually takes several weeks; for entirely new developments, we need to conduct a process evaluation. After receiving your specific requirements, we will provide you with a detailed timeline and quotation as soon as possible.

Q4: What special precautions should be taken when using ceramic sputtering targets to ensure process stability?
A4: When using ceramic sputtering targets, pay attention to proper installation and avoid over-tightening to prevent cracking. It is also recommended to perform thorough pre-sputtering to clean the target surface. For reactive sputtering processes, precise control of oxygen partial pressure and the use of a medium-frequency power supply are crucial for maintaining sputtering stability and preventing target poisoning and arcing.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We are not only a manufacturer of sputtering targets, but also a solution partner for your technical challenges. Based on a deep understanding of the properties of oxide materials and strict, precise control throughout the entire process, we ensure that every target has excellent and consistent performance. We are committed to becoming your trusted long-term partner with professional and reliable products and efficient and flexible services.

Molecular Formula: FeTiO₃
Molecular Weight: 151.71 g/mol
Appearance: Black target
Density: 4.7 g/cm³
Melting Point: >1300 °C
Crystal Structure: Hexagonal (Ilmenite type)

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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