| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 2600ST001 | Fe | 99.95% | Ø 25.4 mm x 3.175 mm | Inquire |
| 2600ST002 | Fe | 99.95% | Ø 50.8 mm x 3.175 mm | Inquire |
| 2600ST003 | Fe | 99.95% | Ø 50.8 mm x 25.4 mm | Inquire |
| 2600ST004 | Fe | 99.95% | Ø 50.8 mm x 6.35 mm | Inquire |
| 2600ST005 | Fe | 99.95% | Ø 76.2 mm x 3.175 mm | Inquire |
| 2600ST006 | Fe | 99.95% | Ø 101.6 mm x 1.58 mm | Inquire |
| 2600ST007 | Fe | 99.95% | Ø 203.2 mm x 2 mm | Inquire |
| 2600ST008 | Fe | 99.99% | Ø 25.4 mm x 6.35 mm | Inquire |
| 2600ST009 | Fe | 99.99% | Ø 50.8 mm x 3.175 mm | Inquire |
| 2600ST010 | Fe | 99.99% | Ø 76.2 mm x 3.175 mm | Inquire |
| 2600ST011 | Fe | 99.99% | Ø 101.6 mm x 3.175 mm | Inquire |
| 2600ST012 | Fe | 99.99% | Ø 152.4 mm x 6.35 mm | Inquire |
Iron sputtering targets serve as a critical foundational material for fabricating functional thin films through physical vapor deposition (PVD) techniques such as magnetron sputtering. Their core advantages lie in exceptionally high metal purity and outstanding ferromagnetic properties. These targets are primarily used in semiconductor manufacturing, display panels, data storage, and scientific research to deposit nanoscale thin films with superior conductivity, magnetism, and stability.
We offer various high-purity iron metal target materials in circular, rectangular, and other specifications. Professional bonding services with oxygen-free copper backing plates are available to optimize heat dissipation and enhance sputtering stability. Additionally, we support deep customization of dimensions, purity, shapes, and even alloy compositions to meet your specific equipment chamber and process requirements. Please contact us anytime for inquiries.
Ultra-high purity
High density
Superior Magnetic Properties
Professional Bonding Process
Semiconductors & Microelectronics: Used for electrode, interconnect, and barrier layer deposition in integrated circuit manufacturing, meeting device miniaturization and high-performance requirements.
Flat Panel Display Technology: Employed in LCD, OLED, and other display production for fabricating precision conductive circuits and critical film layers in thin-film transistors (TFTs).
Data Storage and Magnetic Devices: Serves as core target material for manufacturing magnetic recording media on hard disk platters, various magnetic heads, and high-sensitivity magnetic sensors.
Frontier Research and Optical Coating: Provides high-purity material support for new material development (e.g., spintronic devices) in universities and research institutes, as well as functional coatings for optical components.
Q1: How is the purity of iron targets measured? Which elements are primarily controlled for impurities?
A1: Purity is typically expressed as a percentage. We rigorously test and control key impurities—including alkali metals, heavy metals, and gaseous elements (oxygen, nitrogen)—using precision methods like glow discharge mass spectrometry (GD-MS) to ensure compliance with high-end application standards.
Q2: Is iron a strongly magnetic material?
A2: Yes. The strong magnetism of iron targets can shield magnetic fields, potentially affecting the stability of the sputtering plasma.
Q3: Why do some iron targets require bonding to a backing plate (e.g., copper)?
A3: Bonding a high thermal conductivity backing plate is critical. It rapidly dissipates heat generated during sputtering, preventing target cracking or deformation from localized overheating. This significantly enhances target utilization and operational safety, especially for high-power sputtering processes.
Q4: Can iron-based targets be customized with non-standard dimensions or special alloy compositions?
A4: Absolutely. We possess full-process capabilities from smelting and forging to precision machining, enabling us to customize targets of any size and shape based on your provided drawings.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request
We specialize in high-purity metal materials, delivering not just products but comprehensive solutions. From our deep understanding of sputtering challenges in ferromagnetic targets to our rigorous end-to-end quality control—from raw material purification to final packaging—we ensure every target exhibits exceptional and consistent performance.
Molecular Formula: Fe
Molecular Weight: 55.845 g/mol
Appearance: Lustrous silver-white or metallic gray
Density: Approx. 7.86 – 7.87 g/cm³
Melting Point: Approx. 1538 °C
Boiling Point: Approx. 2750 °C
Crystal Structure: Body-centered cubic (α-Fe) at room temperature
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us