Iridium metal sputtering targets are precious metal materials specially designed for high-end thin film deposition processes and are widely used in high-precision fields such as microelectronics, optics and memory. Its high purity and excellent physical and chemical stability ensure excellent performance under harsh working conditions.
We can provide iridium metal sputtering targets of various specifications, including round, rectangular and special-shaped targets, and support personalized customization according to your specific needs. At the same time, we also provide professional technical support and after-sales service to ensure that customers can use them smoothly and worry-free in every link of the process.
Purity: 99.95%
Melting point up to 2,446°C, suitable for high-temperature processes
High density, improves target utilization and film uniformity
Good corrosion resistance and chemical inertness
Supports customized size, thickness and bonded target services
Magnetic storage devices (MRAM, GMR, TMR, etc.): Iridium as a doping or alloy layer has excellent stability and magnetic performance control capabilities
Microelectronic devices: Used as barrier layer, contact layer or electrode material to improve device reliability
Optical coating: Heat-resistant protective layer for high-reflection mirrors, space telescopes and laser components
Sensors and MEMS devices: Suitable for application scenarios requiring high-stability metal electrodes
We provide a complete certificate of analysis (COA), material safety data sheet (MSDS) and necessary physical and chemical performance test reports for each batch of products. At the same time, we support customers to entrust third-party testing agencies to conduct quality verification to ensure that product quality is fully transparent, reliable and traceable.
Molecular formula: Ir
Molecular weight: 192.22 g/mol
Appearance: Silvery white metallic luster, dense target material, smooth and polished surface
Density: about 22.56 g/cm³ (extremely high density, suitable for precision thin films)
Melting point: about 2,446 °C (high melting point, suitable for high temperature processes)
Crystal structure: face-centered cubic (FCC)
Signal Word:
Danger
Hazard Statements:
H228: Flammable solid
H319: Causes serious eye irritation
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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