Gold Tin Alloy granules are high-purity metallic materials designed for precision soldering, thin film deposition, and advanced electronic packaging. Known for their excellent melting characteristics, high conductivity, and chemical stability, these granules provide superior wetting behavior and uniform alloy composition, ensuring consistent performance in semiconductor and microelectronic processes.
Produced under strict vacuum melting and granulation conditions, Gold Tin Alloy granules feature ultra-low impurity content and high density, enabling stable bonding and precise alloy ratios in demanding applications.
Purity: 99.999%
Excellent melting uniformity and repeatable soldering performance
High conductivity and outstanding oxidation resistance
Customizable composition ratio (e.g., Au80Sn20, Au70Sn30, etc.)
Customizable particle size range (0.5 mm – 5 mm)
Packaging: Vacuum-sealed or inert gas protection
Available forms: Granules, pieces, or shots
Applicable to: Semiconductor packaging, optoelectronic devices, micro-soldering, and precision bonding.
Semiconductor Packaging
Gold Tin Alloy granules are widely used for hermetic sealing and bonding in high-reliability semiconductor devices. Their controlled alloy composition ensures stable joint performance even under high temperature and high frequency conditions.
Optoelectronics
In laser diodes, photodetectors, and LEDs, AuSn alloy granules provide excellent thermal conductivity and reliable metallurgical bonding, supporting long-term optical stability.
Microelectronics and MEMS
Used as a soldering and bonding material in micro-electromechanical systems (MEMS) and microcircuits, Gold Tin Alloy granules ensure precise melting control and minimal void formation.
Aerospace and Defense Electronics
Preferred for high-reliability soldering applications requiring superior corrosion resistance and electrical stability.
Each batch of Gold Tin Alloy granules is accompanied by comprehensive documentation, including:
Material Safety Data Sheet (MSDS)
Particle size distribution and composition report
We also provide third-party testing upon request to ensure compliance with international standards for purity, density, and alloy composition.
Molecular formula: AuSn
Molecular weight: 339.0 g/mol
Appearance: Golden yellow particles with smooth surface
Density: about 9.32 g/cm³
Melting point: about 280 °C
Crystal structure: face-centered cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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