ULPMAT

Germanium metal

Chemical Name:
Germanium metal
Formula:
Ge
Product No.:
3200
CAS No.:
7440-56-4
EINECS No.:
231-164-3
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
3200ST001 Ge 99.999% Ø 25.4 mm x 3.175 mm Inquire
3200ST002 Ge 99.999% Ø 25.4 mm x 6.35 mm Inquire
3200ST003 Ge 99.999% Ø 50.8 mm x 3.175 mm Inquire
3200ST004 Ge 99.999% Ø 50.8 mm x 6.35 mm Inquire
3200ST005 Ge 99.999% Ø 76.2 mm x 3.175 mm Inquire
3200ST006 Ge 99.999% Ø 76.2 mm x 6.35 mm Inquire
3200ST007 Ge 99.999% Ø 101.6 mm x 3.175 mm Inquire
3200ST008 Ge 99.999% Ø 101.6 mm x 6.35 mm Inquire
Product ID
3200ST001
Formula
Ge
Purity
99.999%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
3200ST002
Formula
Ge
Purity
99.999%
Dimension
Ø 25.4 mm x 6.35 mm
Product ID
3200ST003
Formula
Ge
Purity
99.999%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
3200ST004
Formula
Ge
Purity
99.999%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
3200ST005
Formula
Ge
Purity
99.999%
Dimension
Ø 76.2 mm x 3.175 mm
Product ID
3200ST006
Formula
Ge
Purity
99.999%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
3200ST007
Formula
Ge
Purity
99.999%
Dimension
Ø 101.6 mm x 3.175 mm
Product ID
3200ST008
Formula
Ge
Purity
99.999%
Dimension
Ø 101.6 mm x 6.35 mm

Germanium Metal Sputtering Targets Overview 

Germanium metal sputtering targets are dense solid plates manufactured from high-purity germanium metal through precision metallurgical processes (such as melting and hot pressing). They exhibit a silvery-gray metallic luster with a primarily polycrystalline crystal structure. As core consumables in physical vapor deposition (PVD) processes, they are used to deposit high-performance germanium films onto substrates or serve as doping sources.

We offer germanium metal sputtering targets in multiple purities, shapes, and sizes, with bonding services (copper/aluminum backing plate welding) available. Contact us for a quote.

Product Highlights

Ultra-high purity
High density, low porosity
Excellent microstructural uniformity
Bonding services available
Precision control of dimensions and tolerances

Applications of Germanium Metal Sputtering Targets

Semiconductors & Microelectronics: Used for depositing germanium or silicon germanium films as channel materials in high-speed transistors to enhance device performance. As a doping source, introducing germanium into semiconductor processes to adjust material band structure.

Infrared Optics & Detection: Used for depositing infrared anti-reflective coatings, protective films, or fabricating germanium thin-film detectors on optical substrates. Prepares coating materials required for infrared lenses in thermal imaging systems.

Photovoltaics and New Energy: Used to prepare germanium substrate films or buffer layers required for high-efficiency III-V solar cells (e.g., gallium arsenide). Serves as a key functional layer in novel thin-film solar cells (e.g., perovskite/germanium tandem cells).

Data Storage and Functional Coatings: Used for depositing germanium-antimony-tellurium alloy films in phase-change memory. As a wear-resistant, corrosion-resistant functional coating material applied to precision component surfaces.

FAQs

Q1: What are the main differences between germanium and silicon targets?
A1: Germanium targets are used for depositing infrared-transparent, high-mobility films suitable for high-end optics and specialty devices; silicon targets are low-cost and the absolute mainstream for integrated circuit coating.

Q2: What purity level is required?
A2: Depends on the application. Infrared optics typically use 5N (99.999%), while high-end semiconductor devices require 6N (99.9999%) or higher.

Q3: Do you offer bonding services?
A3: Yes. We provide professional target-to-backing plate bonding services (commonly copper backing plates) to ensure heat dissipation and installation stability, delivering ready-to-use targets.

Q4: How should targets be stored and maintained?
A4: Store sealed in a dry, clean environment. Clean the target surface after use to prevent contamination. Ensure shock protection during transport to prevent cracking of brittle targets.

Report

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why choose us?

We provide one-stop target solutions from high-purity materials to precision processing, bonding, and testing—your reliable partner for developing advanced thin-film technologies.

Molecular Formula: Ge
Molecular Weight: 72.63
Appearance: Grayish-white solid target with a metallic luster
Density: 5.35 g/cm³
Melting Point: 938.25 °C
Boiling Point: 2833 °C
Crystal Structure: Diamond cubic structure, space group Fd-3m

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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