ULPMAT

Cupric (II) Oxide

Chemical Name:
Cupric (II) Oxide
Formula:
CuO
Product No.:
290801
CAS No.:
1317-38-0
EINECS No.:
215-269-1
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
290801ST001 CuO 99.9% Ø 50.8 mm x 6.35 mm Inquire
290801ST002 CuO 99.9% Ø 76.2 mm x 6.35 mm Inquire
290801ST003 CuO 99.95% Ø 76.2 mm x 6.35 mm Inquire
290801ST004 CuO 99.95% Ø 101.6 mm x 3.175 mm Inquire
Product ID
290801ST001
Formula
CuO
Purity
99.9%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
290801ST002
Formula
CuO
Purity
99.9%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
290801ST003
Formula
CuO
Purity
99.95%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
290801ST004
Formula
CuO
Purity
99.95%
Dimension
Ø 101.6 mm x 3.175 mm

Cupric Oxide Sputtering Targets Overview 

Cupric Oxide sputtering targets are inorganic oxide materials used for thin film deposition, primarily in the fields of electronic thin films, functional coatings, and related materials research.

We offer high-density, compositionally stable copper oxide sputtering targets, supporting various sizes and structures. Please contact us for technical information and customized solutions.

Product Highlights

Stable phase composition
Dense and uniform target
Smooth sputtering process
Good film repeatability
Fine surface finish
Optional bonding and backplane options
Compatible with various equipment

Applications of Cupric Oxide Sputtering Targets

Electronic and Functional Thin Film Preparation: This target can be used to deposit oxide thin films with stable electrical and physical properties, suitable for various electronic structure designs.
Sensor and Device Materials: In sensors and related devices, it can be used to construct functional thin film layers with high requirements for material composition consistency.
Surface Engineering and Functional Coatings: Forming well-adhesive oxide coatings through sputtering processes for surface modification and performance tuning.
Materials Processing and Fundamental Research: Widely used in research institutions to study thin film structure, film formation conditions, and performance relationships.

FAQs

Q1: Which sputtering methods are suitable for copper oxide (II) sputtering targets?
A1: They can be used for common DC or RF sputtering methods, depending on the equipment requirements and process matching.

Q2: Does the density of the target affect the performance?
A2: Higher density helps improve sputtering stability and film uniformity.

Q3: Do you support targets of different sizes or structures?
A3: We can provide products of different sizes, thicknesses, and structures according to equipment requirements.

Q4: What precautions should be taken when storing targets?
A4: It is recommended to store them in a sealed container to avoid moisture and contamination, in order to maintain the surface condition of the target.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We focus on the manufacturing and quality control of inorganic oxide sputtering targets, emphasizing material uniformity, processing accuracy, and delivery stability, to provide customers with more reliable and easily evaluable thin film deposition solutions.

Chemical Formula: CuO
Molecular Weight: 79.55 g/mol
Appearance: Black, dense target material
Density: 6.31 g/cm³
Melting Point: 1,320 °C
Crystal Structure: Monoclinic

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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