ULPMAT

Copper Sulfide

Chemical Name:
Copper Sulfide
Formula:
CuS
Product No.:
291601
CAS No.:
1317-40-4
EINECS No.:
215-271-2
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
291601ST001 CuS 99.999% Ø 25.4 mm x 3.175 mm Inquire
291601ST002 CuS 99.999% Ø 50.8 mm x 3.175 mm Inquire
291601ST003 CuS 99.999% Ø 50.8 mm x 6.35 mm Inquire
291601ST004 CuS 99.999% Ø 76.2 mm x 6.35 mm Inquire
291601ST005 CuS 99.999% Ø 101.6 mm x 3.175 mm Inquire
Product ID
291601ST001
Formula
CuS
Purity
99.999%
Dimension
Ø 25.4 mm x 3.175 mm
Product ID
291601ST002
Formula
CuS
Purity
99.999%
Dimension
Ø 50.8 mm x 3.175 mm
Product ID
291601ST003
Formula
CuS
Purity
99.999%
Dimension
Ø 50.8 mm x 6.35 mm
Product ID
291601ST004
Formula
CuS
Purity
99.999%
Dimension
Ø 76.2 mm x 6.35 mm
Product ID
291601ST005
Formula
CuS
Purity
99.999%
Dimension
Ø 101.6 mm x 3.175 mm

Copper Sulfide Sputtering Targets Overview 

Copper sulfide sputtering targets are functional materials used for thin film deposition, primarily in optoelectronic devices, conductive thin films, and materials research.

We offer copper sulfide sputtering targets with stable composition and high density/uniformity, supporting various sizes and structures. Contact us for technical information and customized solutions.

Product Highlights

Stable alloy chemical composition
High target density
Good sputtering uniformity
Consistent film composition
Fine surface finish
Optional bonding and backplane options
Compatible with various equipment

Applications of Copper Sulfide Sputtering Targets

Optoelectronic Device Thin Film Preparation: This target can be used to deposit copper sulfide thin films with stable conductivity and semiconductor properties, meeting the needs of optoelectronic device R&D.
Functional Thin Films and Surface Coatings: Forms corrosion-resistant, well-adhesive thin film coatings through sputtering processes for surface modification and functional design.
Sensor and Electronic Device Research: Suitable for applications in sensor and electronic device R&D where high consistency in film composition and performance is required.
Materials Processing and Performance Research: Widely used in research institutions to study thin film structure, deposition conditions, and performance control relationships.

FAQs

Q1: Which sputtering methods are suitable for copper sulfide sputtering targets?
A1: They can be used for common sputtering methods such as DC and RF sputtering. The specific method should be matched according to the equipment conditions.

Q2: Does the density of the target affect the sputtering effect?
A2: Higher density can improve sputtering stability and obtain a more uniform film composition and thickness.

Q3: Can targets of different sizes or shapes be customized?
A3: Customized targets of various sizes, thicknesses, and shapes can be provided according to equipment and process requirements.

Q4: What precautions should be taken when storing and transporting targets?
A4: It is recommended to store them in a sealed container to avoid moisture and contamination, in order to ensure the surface condition and performance of the target.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request

Why Choose Us?

We focus on the manufacturing and quality control of metal sulfide sputtering targets, emphasizing material uniformity, processing accuracy, and delivery stability, to provide reliable and highly evaluable thin film deposition solutions for research and industrial customers.

Chemical Formula: CuS
Molecular Weight: 95.61 g/mol
Appearance: Black, dense target material
Density: 5.6 g/cm³
Melting Point: 1,200 °C (before decomposition)
Crystal Structure: Orthorhombic

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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