| Product ID | Formula | Purity | Dimension | Inquiry |
|---|
Copper Silicon Alloy sputtering targets are copper-silicon alloy coating targets primarily used for depositing high-performance functional films on microelectronic and wear-resistant components.
We manufacture alloy targets with precise composition and uniform microstructure. Contact us for detailed technical documentation and sample information.
Forms low-resistance silicide layers
Dense, strong-bonded coatings
Excellent wear resistance and oxidation resistance
Uniform and stable target structure
Microelectronic Interconnects: Serves as contact material or diffusion barrier layer in semiconductor devices, ensuring stable and reliable circuit connections.
Wear-Resistant Protective Coatings: Applied to cutting tools and critical mechanical components to significantly enhance wear resistance and high-temperature oxidation resistance.
Photovoltaics & Displays: Serves as electrode material for thin-film solar cells or for depositing conductive films in certain display technologies.
Precision Resistor Films: Used to fabricate thin-film resistor elements with excellent temperature stability and high precision.
Q1: What are the primary components of the film formed from copper silicon targets?
A1: Primarily low-resistance copper-silicon compounds (silicides) formed through subsequent heat treatment or in-situ reactions, exhibiting excellent conductivity and thermal stability.
Q2: How does silicon content affect film properties?
A2: Silicon content directly influences the type of silicide formed, as well as the film’s resistivity, hardness, and thermal stability. Precise formulation is required based on specific application objectives.
Q3: What is the conductivity of this film?
A3: The resulting copper-silicon compound film exhibits good conductivity with resistivity between metallic and semiconductor levels, making it suitable for specific electronic applications.
Q4: What are the main advantages over pure copper targets?
A4: The key advantages lie in silicon’s ability to effectively suppress copper atom diffusion, enhance thermal stability and oxidation resistance, and enable the formation of functional silicides through chemical reactions.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We specialize in the R&D and production of high-performance alloy targets. Leveraging our deep understanding of materials science and precision manufacturing capabilities, we ensure exceptional product performance and batch-to-batch consistency. Committed to delivering professional technical solutions and reliable supply assurance, we are your trusted partner.
Molecular formula: CuSi
Appearance: Solid with metallic luster
Crystal structure: Face-centered cubic
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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