Copper nickel sputtering targets are functional alloy materials used for thin film deposition, primarily in the fields of electronic thin films, functional coatings, and related material preparation.
We can provide copper nickel sputtering targets with controllable composition ratios and high density, supporting various sizes and structural forms. Please contact us for technical information and customized solutions.
Uniform alloy composition
High target density
Good sputtering stability
Consistent film composition
High surface processing precision
Optional bonding backplane
Compatible with various equipment
Electronic Thin Film and Conductive Layer Preparation: This target can be used to deposit metal thin films with stable conductivity, suitable for various electronic device structural designs.
Functional Coatings and Surface Modification: In sputtering processes, alloy coatings with corrosion resistance and functional properties can be formed for surface engineering applications.
Sensor and Device Development: Suitable for research scenarios in sensors and related devices where high stability of alloy thin film composition is required.
Materials Processing and Performance Research: Commonly used in research institutions for thin film structure, composition control, and process parameter optimization research.
Q1: Which sputtering methods are suitable for copper nickel sputtering targets?
A1: They can be used for common sputtering methods such as DC or RF sputtering, depending on equipment configuration and process parameters.
Q2: Can the target composition ratio be customized?
A2: Target solutions with different copper-nickel ratios can be provided according to project requirements.
Q3: How stable is the target during use?
A3: Under reasonable process conditions, the target sputtering process is stable, which helps to obtain thin films with uniform composition.
Q4: What precautions should be taken when storing the target?
A4: It is recommended to store the target in a sealed container and avoid humid environments to maintain surface condition and performance.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We specialize in the manufacturing and quality control of alloy sputtering targets, emphasizing material uniformity, processing accuracy, and delivery reliability. We can provide customers with more stable and evaluable thin film deposition solutions.
Chemical Formula: CuNi
Appearance: Silver-gray to metallic gray dense target material
Crystal Structure: Face-centered cubic (FCC) solid solution
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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