Copper Metal Rotary Targets are primarily used in large-area, long-duration continuous sputtering processes, suitable for the preparation of conductive thin films with high deposition efficiency.
We can customize the rotating target structure and parameters according to equipment size and process requirements, supporting technical collaboration and sample verification. Please contact us for solutions.
High-purity copper raw material
High utilization rate of the rotating structure
Excellent thermal conductivity
Stable film composition
Suitable for industrial-grade continuous production
Customizable length and diameter
Flat Panel Display Coating: Used for preparing conductive lines and functional layers, meeting the requirements for uniform deposition on large-size substrates.
Semiconductor Interconnect Layers: Suitable for copper metal interconnect film deposition, processes requiring high stability and repeatability.
Solar Energy and Photovoltaic Fields: Used for electrode and current collector film preparation, supporting long-term continuous operation.
Functional Coatings and Industrial Coatings: Applied to large-area deposition scenarios for wear-resistant, conductive, and decorative coatings.
Q1: What are the advantages of a rotating target compared to a planar target?
A1: Rotating targets significantly improve material utilization and support longer-term stable sputtering.
Q2: Does this product support customized sizes?
A2: Yes, diameter, length, and interface structure can be customized according to the equipment model.
Q3: Which sputtering equipment is it suitable for?
A3: Primarily used in magnetron sputtering systems, especially industrial-grade rotating cathode equipment.
Q4: What precautions should be taken during transportation and storage?
A4: Use anti-oxidation and shockproof packaging. It is recommended to store in a dry, sealed environment.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We have extensive experience in metal target manufacturing and rotating target structure matching, providing continuous and reliable support from materials and processing to application matching, helping customers improve coating efficiency and product consistency.
Chemical Formula: Cu
Molecular Weight: 63.55 g/mol
Appearance: Metallic luster, red cylindrical target
Density: 8.96 g/cm³
Melting Point: 1,085 °C
Boiling Point: 2,562 °C
Crystal Structure: Face-Centered Cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
