Copper metal backing plates primarily serve as supports and heat-conducting components for sputtering targets, improving target heat dissipation efficiency and ensuring the stability of the coating process.
We can process copper backing plates of different sizes and structures according to drawings or equipment requirements. Please feel free to contact us to confirm specifications and delivery time.
Excellent thermal conductivity
Stable purity and density
Strict flatness control
Good dimensional consistency
Compatible with various target types
Magnetron sputtering target assembly: As a key component between the target and the cooling system, it helps to quickly conduct heat, reducing the risk of heat concentration on the target surface.
Semiconductor and display coating equipment: Maintains structural stability under high-power conditions, contributing to improved equipment reliability.
Functional thin film industrial production: Suitable for continuous production lines, reducing process fluctuations caused by thermal deformation.
Q1: What is the main function of a copper backing plate?
A1: Its core function is to provide good thermal conductivity and mechanical support for the target, improving the stability of the sputtering process.
Q2: Can it be used with targets of different materials?
A2: Yes, it can generally be assembled with metal targets, alloy targets, and some ceramic targets.
Q3: How does surface flatness affect performance?
A3: Good flatness helps the target material adhere tightly, improves heat dissipation, and extends service life.
Q4: Do you support non-standard size processing?
A4: Yes, we support customized processing based on equipment structure and installation method.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We have mature experience in metal processing and quality control, and can consistently provide stable, reliable, and highly adaptable copper backplate products.
Chemical Formula: Cu
Molecular Weight: 63.55 g/mol
Appearance: Metallic luster, brass-colored solid
Density: 8.96 g/cm³
Melting Point: 1,085 °C
Boiling Point: 2,562 °C
Crystal Structure: Face-Centered Cubic (FCC)
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
If you need any service, please contact us
