Copper Iron sputtering targets are copper-iron alloy targets primarily used in thin film deposition applications requiring a balance between conductivity and structural stability.
We offer CuFe sputtering targets in various composition ratios and sizes, and support custom processing and technical consultation. Please contact us for detailed information.
Stable copper-iron alloy composition
High target density
Uniform microstructure
Stable sputtering process
Good film repeatability
Balancing conductivity and mechanical properties
Compatible with various sputtering equipment
Electronic and Functional Thin Film Preparation: CuFe sputtering targets can be used to prepare functional metal thin films with both conductivity and structural support.
Semiconductor and Device Research: Commonly used in device development and material verification to explore the electrical and structural properties of copper-iron alloy thin films.
Magnetic-dependent or Composite Performance Thin Films: Copper-iron alloy thin films can be used to develop thin film systems with composite physical properties.
Engineering Experiments and Process Optimization: Suitable for laboratory and pilot-scale applications to verify the thin film deposition effects under different process parameters.
Q1: Which sputtering method is CuFe sputtering target suitable for?
A1: This target can be used for DC or magnetron sputtering, depending on the equipment and process design.
Q2: Does the copper-iron ratio affect film performance?
A2: Yes, different ratios directly affect the conductivity, structural stability, and related physical properties of the film.
Q3: What is the effect of target density on sputtering?
A3: Higher density helps improve sputtering stability and reduce particle generation.
Q4: Does the target require special treatment before use?
A4: Generally, no special treatment is required, but it is recommended to install it under clean conditions to avoid surface contamination.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We possess stable preparation and processing capabilities in the field of alloy sputtering targets, enabling us to strictly control material composition and internal structure, providing customers with CuFe sputtering targets that offer excellent batch consistency and reliable sputtering performance.
Chemical Formula: CuFe
Appearance: Dense target material, silver-gray to metallic gray
Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.
Outer Packaging: Cartons or wooden crates selected based on size and weight.
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