Copper Iodide powder is a high-purity copper iodide material widely used in optoelectronics, electronic conductive materials, and chemical catalysis.
We offer CuI powder in various particle sizes and purity grades, supporting customized packaging and technical consultation. Please contact us for detailed solutions.
High purity, low impurities
Fine powder, good dispersibility
Strong chemical stability
Easy to dissolve and process
Suitable for thin film preparation
Reliable batch consistency
Supports research and industrial applications
Optoelectronic Materials: CuI powder can be used in the preparation of transparent conductive films and optoelectronic active layers, improving device efficiency and stability.
Catalysts and Chemical Synthesis: In organic synthesis and catalytic reactions, CuI powder can be used as a reaction intermediate or catalyst.
Conductive Films and Electronic Devices: Suitable for preparing conductive layers in flexible and transparent electronic materials.
Q1: Will CuI powder decompose in air?
A1: CuI is stable in air, but prolonged exposure to moisture or strong light may affect its performance; it should be stored in a sealed container.
Q2: How does powder particle size affect applications?
A2: Smaller particle size results in better dispersibility and solubility; larger particle size is suitable for pressing or sintering processes.
Q3: Is this powder suitable for thin film deposition?
A3: Yes, CuI powder can be used in solution processing, thermal evaporation, or other thin film preparation processes.
Q4: What storage conditions are required?
A4: It is recommended to store in a dry, sealed container, avoiding high humidity and direct sunlight to maintain powder performance.
Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Third-party testing reports available upon request
We focus on the research and development and production of high-purity inorganic chemical powders, strictly controlling raw materials and production processes to ensure the stability and batch consistency of CuI powder in scientific research and industrial applications.
Chemical Formula: CuI
Molecular Weight: 190.45 g/mol
Appearance: White to pale yellow powder
Density: 5.62 g/cm³
Melting Point: 588 °C
Boiling Point: 1,300 °C
Crystal Structure: Cubic
Signal Word:
Warning
Hazard Statements:
H302 Harmful if swallowed
H315 Causes skin irritation
H319 Causes serious eye irritation
H335 May cause respiratory irritation
Inner Packaging: Double-layer sealed plastic bags or aluminum foil bags for moisture and leakage protection.
Outer Packaging: Iron drum or fiber drum, depending on the weight, with reinforced sealed lid.
Hazard Packaging: UN-certified packaging compliant with regulations for hazardous materials transportation.
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