ULPMAT

Boron Carbide

Chemical Name:
Boron Carbide
Formula:
B4C
Product No.:
050600
CAS No.:
12069-32-8
EINECS No.:
235-111-5
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
050600ST001 B4C 99.5% Ø 101.6mm x 3.175mm Inquire
050600ST002 B4C 99.5% 25 mm x 25 mm x 1 mm th. Inquire
Product ID
050600ST001
Formula
B4C
Purity
99.5%
Dimension
Ø 101.6mm x 3.175mm
Product ID
050600ST002
Formula
B4C
Purity
99.5%
Dimension
25 mm x 25 mm x 1 mm th.

Boron Carbide Sputtering Target Overview

Boron Carbide sputtering targets are high-hardness, chemically stable ceramic targets suitable for preparing ultra-hard thin films and functional coatings. They are primarily used in electronic, optical protection, and composite film deposition.

We offer customized B4C sputtering targets in various sizes, thicknesses, and backplane configurations to support both research and industrial applications. Please contact us directly for quotations and technical support.

Product Highlights

Ultra-high hardness target
Uniform and stable composition
Controllable sputtering rate
Supports RF sputtering
Can bond copper or other backplanes
Suitable for R&D and pilot-scale production

Applications of Boron Carbide Sputtering Targets

Ultra-hard Thin Film Preparation: Can be used to prepare high-hardness thin films, improving the wear resistance and impact resistance of coatings.
Optical and Protective Coatings: Suitable for optical components and protective coatings, improving surface hardness and corrosion resistance.
Electronic and Functional Material Deposition: This target can deposit electronic devices and functional thin films, ensuring uniformity and repeatability of film formation.
Thin Film Process Parameter Optimization: Suitable for RF sputtering process development and parameter verification, helping to optimize power, atmosphere, and deposition rate.

FAQs

Q1: Do you support custom non-standard sizes?
A1: Yes, we can process them according to equipment size and process requirements.

Q2: Can the target be bonded to a backplate?
A2: Yes, copper or other metal backplates can be bonded to improve heat dissipation and operational stability.

Q3: Which sputtering method is it suitable for?
A3: Suitable for RF sputtering. Ceramic targets have good stability at high power.

Q4: Can you provide samples or small batch orders?
A4: Yes, to meet the needs of research and process verification stages.

Reports

Each batch is supplied with:
Certificate of Analysis (COA)
Technical Data Sheet (TDS)
Material Safety Data Sheet (MSDS)
Size Inspection Report
Third-party testing reports available upon request

Why Choose Us?

We specialize in the R&D and supply of ceramic sputtering targets, providing stable batches, customized specifications, and technical support. We respond quickly to customer needs, helping research and industrial production proceed smoothly.

Molecular Formula: B4C
Molecular Weight: 55.26 g/mol
Appearance: Black, dense target block
Density: 2.52–2.55 g/cm³
Melting Point: 2450 °C (decomposes)
Crystal Structure: Rhombohedral

Inner Packaging: Vacuum-sealed bags and boxed to prevent contamination and moisture.

Outer Packaging: Cartons or wooden crates selected based on size and weight.

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