| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 130700TC001 | AlN | / | 101.6mm × 101.6mm × 0.381mm | Inquire |
| 130700TC002 | AlN | / | 114.3mm × 114.3mm × 0.5mm | Inquire |
| 130700TC003 | AlN | / | 120mm × 120mm × 0.635mm | Inquire |
| 130700TC004 | AlN | / | 127mm × 127mm × 1.0mm | Inquire |
| 130700TC005 | AlN | / | 139.7mm × 190.5mm × 1.5mm | Inquire |
| 130700TC006 | AlN | / | 50.8mm × 50.8mm × (0.1~0.2)mm | Inquire |
| 130700TC007 | AlN | / | 76.2mm × 76.2mm × (0.2~0.3)mm | Inquire |
| 130700TC008 | AlN | / | 101.6mm × 101.6mm × (2.0~3.0)mm | Inquire |
| 130700TC009 | AlN | / | 114.3mm × 114.3mm × (2.0~3.0)mm | Inquire |
| 130700TC010 | AlN | / | 150mm/200mm/300mm × (1.0~3.0)mm | Inquire |
Aluminum nitride substrates are thin, flat ceramic green sheets fabricated by precision tape-casting technology, offering excellent thermal conductivity, electrical insulation, and mechanical strength after sintering. These sheets are widely used in high-power electronics, LED packaging, substrate manufacturing, and other demanding thermal management applications.
Our Aluminum nitride substrates are formulated with high-purity AlN powder and optimized organic binders to ensure uniform thickness, smooth surfaces, and excellent green density. Customizable dimensions, thicknesses, and binder systems are available to support a wide range of downstream ceramic processing requirements such as cutting, laminating, and sintering.
Purity: ≥99.9% (based on AlN powder)
Thickness: 50–500 μm (customizable)
Smooth, defect-free surface for precision processing
Uniform shrinkage and good dimensional control
Power Electronics Substrates: Ideal for IGBT, MOSFET, and GaN/SiC modules
LED Packaging: Base plates for high-brightness LEDs requiring heat dissipation
DCB/AMB Substrates: Base layer for metallized ceramic boards
Multilayer Ceramics: Suitable for laminated ceramics and co-firing processes
Advanced Ceramics Fabrication: Base material for precision ceramics and MEMS parts
Sheet size: Up to 200 mm × 200 mm or roll form upon request
Thickness range: 50–500 μm (standard); thinner or thicker options available
Binder system: Organic (e.g., PVB, PMMA), solvent- or water-based
Additives: Plasticizers, dispersants, or sintering aids can be incorporated
Roll-to-roll or single-sheet formats
Each batch is subjected to strict QC inspection for thickness uniformity, surface quality, binder consistency, and shrinkage profile. Analytical techniques include:
SEM (surface morphology)
Optical inspection (defect detection)
COA and MSDS are provided with every shipment. Tailored characterization (e.g., thermal conductivity after sintering) can be offered upon request.
As a reliable aluminum nitride substrates supplier, we provide high-thermal-conductivity, electrically insulating AlN substrates with excellent mechanical strength and dimensional precision. Our products feature low dielectric loss, high purity, and customizable sizes to meet the strict demands of electronics, power devices, and LED applications. With strict quality control and global, compliant delivery, we ensure consistent performance and dependable supply.
Chemical Formula: AlN
Appearance: Off-white to grayish green ceramic green tape
Binder System: Customizable (e.g., acrylic, PVB, water-based)
Shrinkage (after sintering): Typically 15–20% linear
Green Density: ~1.2–1.6 g/cm³ (depends on formulation)
Sintered Density: ≥3.2 g/cm³
Thermal Conductivity (after sintering): ≥170 W/m·K
Dielectric Strength: ≥15 kV/mm (sintered)
CTE: ~4.5–5.3 × 10⁻⁶ /K
Not classified as hazardous
Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.
Outer packaging: Carton or wooden box, depending on size and weight.
Fragile targets: Special protective packaging is used to ensure safe transport.
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