ULPMAT

Aluminum Nitride

Chemical Name:
Aluminum Nitride
Formula:
AlN
Product No.:
130700
CAS No.:
24304-00-5
EINECS No.:
246-140-8
Form:
Sputtering Target
HazMat:
Product ID Formula Purity Dimension Inquiry
130700ST001 AlN 99.9% Ø 25mm x 5mm Inquire
130700ST002 AlN 99.9% Ø 50.8mm x 3.2mm Inquire
130700ST003 AlN 99.5% Ø 76.2mm x 3mm Inquire
Product ID
130700ST001
Formula
AlN
Purity
99.9%
Dimension
Ø 25mm x 5mm
Product ID
130700ST002
Formula
AlN
Purity
99.9%
Dimension
Ø 50.8mm x 3.2mm
Product ID
130700ST003
Formula
AlN
Purity
99.5%
Dimension
Ø 76.2mm x 3mm

Aluminum nitride sputtering targets Overview

Aluminum nitride sputtering targets are high-performance ceramic materials featuring excellent thermal conductivity, high electrical insulation, and strong chemical stability. These properties make them an ideal choice for thin-film deposition in semiconductor, optoelectronic, and dielectric layer applications.

Our aluminum nitride sputtering targets are manufactured with high purity and refined microstructure to ensure excellent film uniformity, strong adhesion, and stable deposition rates. Whether for R&D or large-scale industrial production, we offer reliable quality and professional technical support to help you meet your specific performance requirements.

Product Highlights

High Purity aluminum nitride sputtering targets: ≥99.9%
Low oxygen and impurity content for superior film quality
Available in various shapes (disc, rectangular) and dimensions
Tight grain structure and homogeneous composition for uniform sputtering

Applications of Aluminum Nitride Sputtering Targets

Semiconductor Devices: Insulating layers, buffer layers, and passivation films
Optoelectronic Components: Thin films for LEDs, laser diodes, and photodetectors
Thermal Management Coatings: Thin films on substrates requiring efficient heat dissipation
Surface Acoustic Wave (SAW) Devices: High-performance dielectric layers
Protective Coatings: In harsh chemical or thermal environments requiring stable ceramic films

Reports

Each batch of AlN sputtering targets is delivered with a Certificate of Analysis (COA) and Material Safety Data Sheet (MSDS). Standard analysis includes chemical purity, density, phase composition (XRD), and microstructure inspection (SEM). Additional third-party testing and RoHS/REACH compliance reports are available upon request.

Why Choose Us?

Consistent Quality: Tight process control for uniform grain size and density
Customization: Target size, shape, and bonding service tailored to your system
Technical Expertise: Support for sputtering parameters, film properties, and troubleshooting
Global Delivery: Safe, compliant international shipping with complete documentation

Chemical Formula: AlN
Appearance: White to light gray
Density: ~3.255 g/cm³
Melting Point: ~2,500 °C
Thermal Conductivity: ≥170 W/m·K (theoretical)
Electrical Resistivity: >10¹³ Ω·cm
Solubility: Hydrolyzes slowly in water and acids
Crystal Structure: Hexagonal (Wurtzite)
Stability: Moisture-sensitive; stable in inert atmospheres

Not classified as hazardous

Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.

Outer packaging: Carton or wooden box, depending on size and weight.

Fragile targets: Special protective packaging is used to ensure safe transport.

SKU 130700ST Category Tags: Brand:

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