| Product ID | Formula | Purity | Dimension | Inquiry |
|---|---|---|---|---|
| 132900ST001 | AlCu | 99.99% | Ø 101.4 mm x 6mm | Inquire |
| 132900ST002 | AlCu | 99.99% | Ø 101.4 mm x 6mm | Inquire |
| 132900ST003 | AlCu | 99.99% | Ø 101.6 mm x 5mm | Inquire |
| 132900ST004 | AlCu | 99.999% | 127 mm x 457.2 mm x 6mm | Inquire |
| 132900ST005 | AlCu | 99.999% | 127 mm x 457.2 mm x 6mm | Inquire |
| 132900ST006 | AlCu | 99.99% | 1500 mm x 125 mm x 10mm | Inquire |
Aluminum Copper Alloy sputtering targets are high-performance composite materials engineered for thin-film deposition processes that require enhanced electrical conductivity, mechanical strength, and thermal stability. We offer customizable compositions and sizes to meet specific needs, along with comprehensive after-sales support—please feel free to contact us if you have any questions regarding its use.
Each target is manufactured using high-purity raw materials and precision casting, hot-pressing, or powder metallurgy techniques to ensure excellent homogeneity, low impurity content, and consistent film quality. The presence of copper enhances the hardness and electromigration resistance of aluminum-based films, making AlCu targets ideal for demanding deposition environments.
Purity: ≥99.9%
Available Compositions: Al-2wt%Cu, Al-4wt%Cu, Al-8wt%Cu (custom ratios available)
Excellent Electrical and Thermal Conductivity
Improved Electromigration and Corrosion Resistance
High Density for Uniform Film Formation
Customizable Shapes and Dimensions (circular, rectangular, etc.)
Semiconductors: Used in interconnects and contact layers where improved reliability and resistance to electromigration are essential.
Thin-Film Transistors (TFTs): Provides improved mechanical stability and conductivity for high-performance displays.
Photovoltaics: Serves as a conductive back electrode layer in solar cells, offering superior adhesion and reflectivity.
Optical Coatings: Applied to lenses and mirrors to create durable, high-reflectivity coatings with thermal resistance.
Data Storage: Deposited as part of multilayer structures in hard disks and memory devices for performance and durability.
Certificate of Analysis (COA)
Material Safety Data Sheet (MSDS)
RoHS Compliance Documents (upon request)
Third-Party Testing Available on Request
Chemical Formula: AlCu
Appearance: Metallic
Melting Point: 548–660 °C (depending on Cu content)
Thermal Conductivity: 180–235 W/m·K
Electrical Conductivity: ~2.5–3.5 × 10⁷ S/m
Crystal Structure: FCC with intermetallic phases (depending on Cu%)
Magnetic Properties: Non-magnetic
Not classified as hazardous
Inner packaging: Vacuum-sealed bag to protect against contamination and moisture.
Outer packaging: Carton or wooden box, depending on size and weight.
Fragile targets: Special protective packaging is used to ensure safe transport.
If you need any service, please contact us
